EP2C15AF256C8N

The EP2C15AF256C8N is a Cyclone® II family FPGA from Intel, provided in a 256-ball LBGA package. It combines a mid-range logic capacity with on-chip embedded memory and a substantial I/O complement to support custom digital logic, embedded processing and low-cost DSP implementations.

Designed for commercial applications, this device offers 14,448 logic elements, approximately 0.24 Mbits of embedded memory, and 152 user I/O, operating from a core supply range of 1.15 V to 1.25 V and across a 0 °C to 85 °C temperature range. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Core Logic — 14,448 logic elements provide capacity for implementing complex combinational and sequential logic functions tailored to application requirements.
• Embedded Memory — Approximately 0.24 Mbits of on-chip RAM (239,616 total ram bits) for buffering, small-data storage and local state retention.
• I/O Density — 152 general-purpose I/O pins to support a variety of parallel and serial interfaces and extensive board-level connectivity.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match system power architectures and ensure predictable core operation.
• Package & Mounting — 256-LBGA package (supplier designation 256-FBGA, 17×17) for high pin-density surface-mount integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for temperature-controlled and general-purpose environments.
• Standards & Compliance — RoHS compliant for environmental and regulatory alignment.
• Documentation — Supported by Cyclone II device documentation that details architecture, configuration, I/O structure and timing characteristics.

Typical Applications

• Embedded processing — Implement system control, peripheral supervision and custom finite-state machines using the device’s logic array and on-chip memory.
• Low-cost DSP — Deploy signal processing building blocks and fixed-function accelerators where a mid-range logic fabric and embedded memory meet cost targets.
• High-density I/O interfacing — Drive multi-device control, sensor aggregations or parallel bus interfaces leveraging 152 I/O pins for broad connectivity.
• Custom logic and prototyping — Rapidly implement and iterate custom digital functions and interface logic in a compact 256-LBGA form factor.

Unique Advantages

• Balanced logic and memory — 14,448 logic elements combined with approximately 0.24 Mbits of RAM support a wide range of designs without immediate need for external memory.
• High I/O count — 152 I/O pins simplify board routing for multi-peripheral systems and parallel interfaces.
• Compact, board-friendly package — 256-LBGA (17×17) enables a dense footprint suitable for space-constrained PCBs while maintaining robust connectivity.
• Commercial temperature rating — Specified operation from 0 °C to 85 °C for mainstream electronics and consumer-facing products.
• Regulatory alignment — RoHS compliance supports environmentally conscious product designs and supply requirements.
• Documented architecture — Cyclone II device handbook and associated documentation provide detailed guidance on logic elements, memory, I/O structure, clocks and configuration options.

Why Choose EP2C15AF256C8N?

The EP2C15AF256C8N is positioned as a cost-conscious Cyclone II FPGA option that balances programmable logic capacity, embedded memory and I/O resources in a compact surface-mount package. Its specifications—14,448 logic elements, approximately 0.24 Mbits of RAM, 152 I/O and a 256-LBGA footprint—make it suitable for designers implementing embedded processing, I/O-rich interfaces and low-cost DSP functions in commercial-temperature systems.

For teams needing documented device architecture and practical on-chip resources without moving to larger, higher-cost device families, this Cyclone II device provides a predictable, documented platform with RoHS compliance and manufacturer documentation to support design, timing and configuration decisions.

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