EP2C15AF484C6N

The EP2C15AF484C6N is an Intel Cyclone® II field programmable gate array (FPGA) in a 484-BGA package designed for commercial embedded applications. It integrates 14,448 logic elements across 903 LABs and provides approximately 0.24 Mbits of on-chip embedded memory alongside 315 user I/O pins, enabling flexible custom logic, I/O aggregation, and embedded processing tasks.

This device targets low-cost embedded processing and DSP-oriented designs while offering documented device architecture and configuration resources through the Cyclone II device handbook. Key electrical and mechanical characteristics include a 1.15 V to 1.25 V core supply range, surface-mount 484-FBGA (23×23) packaging, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Programmable Logic  903 LABs delivering 14,448 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.24 Mbits (239,616 total RAM bits) of on-chip RAM for buffers, FIFOs, and small embedded data storage.
• I/O Capacity  315 user I/O pins suitable for interfacing with sensors, peripherals, memory, and external logic.
• Package & Mounting  484-ball BGA (484-FBGA, 23×23) in a surface-mount form factor to support compact board-level integration.
• Power  Core voltage supply range of 1.15 V to 1.25 V for compatibility with target system power rails.
• Operating Range  Commercial grade operation specified from 0 °C to 85 °C for mainstream embedded deployments.
• Compliance  RoHS compliant to meet standard environmental requirements for lead-free assembly.
• Documentation  Supported by the Cyclone II device handbook and related configuration/testing documentation for design and integration guidance.

Typical Applications

• Embedded Control  Implement custom control logic, state machines, and glue logic for industrial and commercial embedded systems.
• Digital Signal Processing  Support DSP-oriented functions and low-cost signal-processing blocks using the Cyclone II architecture and on-chip memory.
• I/O Aggregation & Interface Bridging  Consolidate multiple peripheral interfaces or bridge between system buses using abundant I/O resources.
• Prototyping & Custom ASIC Replacement  Validate hardware algorithms and replace small fixed-function ASICs with reprogrammable logic during development and production.

Unique Advantages

• Balanced Logic Density:  14,448 logic elements across 903 LABs provide a practical balance of capacity for mid-size custom logic implementations.
• On-Chip Memory for Local Storage:  Approximately 0.24 Mbits of embedded RAM reduces external memory requirements for small buffers and local data paths.
• High I/O Count:  315 I/O pins support rich peripheral connectivity and complex board-level interfacing without immediate expansion hardware.
• Compact BGA Packaging:  484-FBGA (23×23) surface-mount package enables dense board layouts and compact system designs.
• Commercial Temperature Rating:  Specified for 0 °C to 85 °C operation to match a wide range of mainstream embedded environments.
• Standards-Oriented Compliance:  RoHS compliance supports lead-free manufacturing flows and regulatory requirements.

Why Choose EP2C15AF484C6N?

The EP2C15AF484C6N positions itself as a versatile Cyclone II FPGA option for engineers needing mid-range logic capacity, meaningful on-chip memory, and extensive I/O in a compact BGA package. Its documented device handbook and architectural resources simplify configuration, testing, and system integration for embedded and DSP-focused designs.

Choose this device when your design requires reprogrammable logic with a clear balance of integration, I/O flexibility, and package density, backed by Cyclone II documentation and Intel (Altera) product support materials.

Request a quote or submit an inquiry to receive pricing, availability, and order lead-time information for EP2C15AF484C6N.