EP2C15AF484C7N

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 14448 484-BGA

Quantity 497 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs903Number of Logic Elements/Cells14448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C15AF484C7N – Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 14448 484-BGA

The EP2C15AF484C7N is an Intel Cyclone® II series Field Programmable Gate Array (FPGA) provided in a 484-ball FBGA package. Built on the Cyclone II architecture, this commercial‑grade FPGA combines a mid‑density logic fabric with embedded memory and a flexible I/O complement for cost‑sensitive embedded and DSP‑oriented designs.

With 14,448 logic elements, approximately 0.24 Mbits of embedded RAM, and 315 I/O pins, the device is suited to applications that require integrated logic, moderate on‑chip memory, and a substantial number of external interfaces while operating from a low‑voltage core supply.

Key Features

  • Logic Capacity  14,448 logic elements provide mid‑density programmable logic suitable for complex control, glue logic, and moderate computational tasks.
  • Embedded Memory  Approximately 0.24 Mbits of on‑chip RAM (239,616 total RAM bits) for data buffering, FIFOs, and small lookup tables.
  • I/O Richness  315 I/O pins allow multiple parallel interfaces and peripheral connections for system expansion and external memory interfacing.
  • Low‑Voltage Core  Core supply range of 1.15 V to 1.25 V to align with modern low‑voltage system rails.
  • Package & Mounting  484‑ball FBGA (23×23) surface‑mount package provides a compact, high‑density footprint for PCB designs.
  • Commercial Temperature Grade  Specified operating temperature from 0 °C to 85 °C for commercial electronic environments.
  • RoHS Compliant  Conforms to RoHS requirements for lead‑free assembly and regulatory compliance in applicable markets.
  • Cyclone II Family Capabilities  Based on Cyclone II device architecture with family features such as embedded multipliers, PLLs, global clock networks, and flexible I/O structure as documented in the Cyclone II handbook.

Typical Applications

  • Low‑Cost Embedded Processing  Ideal for control and signal coordination tasks in cost‑sensitive embedded systems that benefit from on‑chip logic and memory.
  • DSP and Signal Processing  Applicable to low‑cost DSP functions where mid‑range logic density and embedded memory support filtering, buffering, and fixed‑point processing.
  • Interface Bridging & Peripheral Control  Use the generous I/O set to implement protocol bridges, sensor interfaces, and custom peripheral controllers.
  • Prototyping & Product Development  Suitable for evaluation and development of digital designs that require moderate logic resources in a compact package.

Unique Advantages

  • Compact, mid‑density logic fabric: 14,448 logic elements provide a balance between capability and cost for many embedded and DSP tasks.
  • On‑chip memory for system efficiency: Approximately 0.24 Mbits of embedded RAM reduces dependency on external memory for buffering and small data storage.
  • High I/O count: 315 I/O pins enable flexible external interfacing and parallel connectivity without large external glue logic.
  • Space‑efficient packaging: 484‑FBGA (23×23) delivers a small PCB footprint while preserving signal density for complex designs.
  • Low core voltage support: 1.15 V to 1.25 V core supply aligns with modern power‑efficient system architectures.
  • Documented Cyclone II features: Family‑level architecture support for PLLs, embedded multipliers, and robust clocking options simplifies implementation of timing‑sensitive designs.

Why Choose EP2C15AF484C7N?

The EP2C15AF484C7N positions itself as a practical, cost‑aware FPGA choice within the Cyclone II family, offering a middle ground of logic capacity, embedded memory, and abundant I/O in a compact FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of consumer and embedded applications that require reliable, low‑voltage programmable logic.

Designers seeking to consolidate glue logic, implement moderate DSP or control functions, or prototype system interfaces will find this device provides an effective combination of integration, documented family features, and a PCB‑friendly package format.

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