EP2C20AF256I8N

The EP2C20AF256I8N is a Cyclone® II field programmable gate array (FPGA) from Intel, offered in a 256-LBGA package and specified for industrial temperature ranges. It integrates 18,752 logic elements and on-chip embedded memory to support low-cost embedded processing and DSP-oriented designs.

Designed for surface-mount assembly and RoHS-compliant production, this device targets applications that require moderate logic density, a high I/O count, and flexible configuration and clocking features as described in the Cyclone II device documentation.

Key Features

• Logic Capacity  Provides 18,752 logic elements to implement combinational and sequential logic functions for mid-range FPGA designs.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) to support data buffering, small FIFOs and lookup tables.
• I/O and Packaging  152 I/O pins in a 256-LBGA package; supplier device package listed as 256-FBGA (17×17). Surface-mount mounting type facilitates compact board layouts.
• Power Supply  Core voltage specified from 1.15 V to 1.25 V to match platform power-rail design requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments where extended temperature tolerance is required.
• Configuration & Clocking Capabilities  Cyclone II architecture documentation describes multiple configuration schemes, global clock network support and PLLs for flexible clock management.
• I/O Structure & Standards  Cyclone II device references include advanced I/O standard support, programmable drive strength, and high-speed differential interface options for varied signaling needs.
• Design & Test Support  Device handbook content documents JTAG (IEEE 1149.1) boundary-scan support and configuration/testing features to streamline development and verification.
• Regulatory & Compliance  RoHS-compliant for environmentally responsible manufacturing and supply-chain compliance.

Typical Applications

• Low-Cost Embedded Processing  Implement control and glue-logic functions for embedded systems, leveraging the device’s logic density and on-chip memory.
• Low-Cost DSP Solutions  Deploy DSP-oriented processing blocks and data-path logic using the Cyclone II architecture’s multiplier and memory resources described in the device handbook.
• High-Speed I/O and External Memory Interfaces  Support designs requiring advanced I/O standards and external memory interfacing using documented I/O structure and memory interface features.
• Industrial Control and Automation  Use the industrial temperature rating and 152 I/Os for sensor interfacing, motor control logic, and industrial communications endpoints.

Unique Advantages

• Balanced Logic and Memory Resources:  18,752 logic elements together with approximately 0.24 Mbits of embedded RAM provide a compact platform for moderate-complexity digital designs.
• High I/O Density in a Compact Package:  152 I/Os in a 256-LBGA package (supplier package: 256-FBGA, 17×17) reduce board area while supporting rich peripheral connectivity.
• Industrial Temperature Support:  Rated from −40 °C to 100 °C to meet the thermal requirements of industrial applications without additional derating statements.
• Flexible Clocking and Configuration:  Cyclone II architecture documentation details global clock networks, PLLs and multiple configuration schemes to adapt to varied timing and startup requirements.
• Design-for-Test and Integration:  JTAG boundary-scan support and documented configuration/testing features simplify validation and production test flows.
• Compliance and Assembly:  RoHS-compliant and surface-mount compatible for environmentally compliant manufacturing and automated PCB assembly processes.

Why Choose EP2C20AF256I8N?

The EP2C20AF256I8N positions itself as a practical Cyclone II FPGA option for engineers needing a mid-range logic device with substantial I/O capability and on-chip memory, combined with industrial temperature tolerance. Its documented Cyclone II architecture features—clocking options, configuration modes and I/O flexibility—support a wide range of embedded processing and DSP-focused designs.

This device is well suited for teams building compact, RoHS-compliant systems that require a reliable balance of logic density, I/O count and thermal robustness, while benefiting from the Cyclone II device family documentation and design guidance.

Request a quote or submit an inquiry to evaluate EP2C20AF256I8N for your next embedded or industrial FPGA design.