EP2C20AF484I8N

The EP2C20AF484I8N is a Cyclone II family FPGA supplied by Intel. It delivers a mid-range programmable logic solution with 18,752 logic elements and approximately 0.24 Mbits of embedded memory in a compact 484-ball BGA package.

Designed for low-cost embedded processing and DSP-oriented applications, this device targets systems that require significant I/O capacity (315 I/Os), industrial temperature operation, and a narrow core voltage range for predictable power design.

Key Features

• Programmable Logic  18,752 logic elements provide flexible, reconfigurable logic capacity for custom digital designs.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM to support buffers, FIFOs, and distributed storage within the FPGA fabric.
• I/O Density  315 general-purpose I/Os for broad interfacing options to peripherals, sensors, and external logic.
• Package  484-BGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
• Power  Core voltage supply range of 1.15 V to 1.25 V for the device core rails.
• Temperature & Grade  Industrial-grade device qualified for operation from −40 °C to 100 °C.
• Compliance  RoHS-compliant manufacturing status.

Typical Applications

• Embedded Processing  Implement control logic, custom state machines, or soft processors where reconfigurable logic and on-chip RAM are required.
• Digital Signal Processing  Support DSP pipelines and arithmetic-intensive blocks using the device’s logic and embedded memory resources for low-cost DSP solutions.
• I/O-Intensive Systems  Use the 315 I/Os to connect multiple peripherals, sensors, or parallel interfaces in applications that require substantial external connectivity.
• Industrial Electronics  Suitable for production systems that require operation across the industrial temperature range and surface-mount PCB assembly.

Unique Advantages

• Significant Logic Capacity: 18,752 logic elements enable complex custom logic implementations without external ASICs.
• On-Chip Memory for Data Handling: Approximately 0.24 Mbits of embedded RAM reduces the need for external memory for many buffer and FIFO needs.
• High I/O Count: 315 I/Os simplify board-level connectivity and reduce the need for external I/O expanders.
• Industrial Temperature Range: Rated for −40 °C to 100 °C, supporting designs that must operate reliably in harsher environments.
• Compact BGA Package: The 484-FBGA (23×23) package balances pin count and board space for dense designs.
• RoHS Compliance: Environmentally compliant manufacturing status for regulated product programs.

Why Choose EP2C20AF484I8N?

The EP2C20AF484I8N positions itself as a mid-range Cyclone II FPGA option for engineers needing a balance of logic capacity, embedded memory, and high I/O density in an industrial-grade package. Its defined core voltage range and BGA package simplify power and board-level design decisions for production systems.

This device is suited to development and deployment of embedded control, DSP, and I/O-intensive applications where predictable operating temperature range, RoHS compliance, and a sizable logic fabric are primary requirements.

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