EP2C20F256C7

The EP2C20F256C7 is an Intel Cyclone® II family field-programmable gate array (FPGA) in a 256-pin L-BGA package. Built for low-cost embedded processing and DSP-oriented solutions, it combines a sizable logic fabric with embedded memory and flexible I/O to accelerate custom digital designs.

As a commercial-grade, surface-mount device, the part delivers 18,752 logic elements, approximately 0.24 Mbits of on-chip RAM, and 152 general-purpose I/O pins, making it suitable for compact, board-level digital systems that require configurable logic and multiple I/O standards.

Key Features

• Core Logic 18,752 logic elements for implementation of custom logic, state machines, and moderate-complexity designs.
• Embedded Memory Approximately 0.24 Mbits of on-chip RAM, enabling local data buffering, FIFOs, and small working-memory structures.
• I/O Capacity & Flexibility 152 I/O pins support a range of external interfaces and signaling options described in the Cyclone II device documentation.
• Power Supply Range Core operating voltage between 1.15 V and 1.25 V for predictable core power requirements.
• Package & Mounting 256-LBGA package (supplier device package listed as 256-FBGA, 17×17) in a surface-mount format for high-density PCB assembly.
• Operating Conditions Commercial temperature rating from 0 °C to 85 °C and RoHS compliance for standard commercial applications.
• Family-Level Features (Cyclone II) Device handbook documents embedded multipliers, PLLs, global clock networks, and configurable I/O features for system-level design options.

Typical Applications

• Low-Cost Embedded Processing — Implements custom peripheral glue logic, control units, and embedded processing accelerators where cost and integration are priorities.
• DSP and Signal Processing — Suitable for moderate DSP tasks using the Cyclone II family’s documented multiplier and memory resources.
• Memory Interface & Bridging — Acts as an interface bridge or controller for external memory and peripheral buses leveraging on-chip routing and I/O flexibility.
• Communications & Interfaces — Provides configurable I/O and clocking resources for protocol translation, serialization/deserialization, and board-level link logic.

Unique Advantages

• High logic density: 18,752 logic elements provide the capacity to integrate multiple functions into a single device, reducing external components.
• On-chip RAM for local buffering: Approximately 0.24 Mbits of embedded memory supports data buffering and small lookup tables without external RAM.
• Generous I/O count: 152 I/O pins give designers flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact package: 256-LBGA (supplier 256-FBGA, 17×17) enables high-density board layouts while maintaining surface-mount assembly compatibility.
• Defined power envelope: Core supply range of 1.15 V–1.25 V simplifies power-supply design and verification.
• Commercial readiness and compliance: Commercial temperature rating (0 °C–85 °C) and RoHS compliance align with standard commercial product requirements.

Why Choose EP2C20F256C7?

The EP2C20F256C7 positions itself as a balanced Cyclone II FPGA option for designers seeking a mix of configurable logic, on-chip memory, and flexible I/O in a compact package. Its documented Cyclone II family features—such as embedded multipliers, PLLs, and a global clock network—support a variety of embedded processing and DSP use cases without relying on external accelerators.

This device is well suited for product designs that require moderate logic capacity, local memory, and a robust set of I/O while maintaining standard commercial operating conditions. Developers can rely on the Cyclone II device handbook and family documentation for implementation guidance and design reference.

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