EP2C20F256C6N

The EP2C20F256C6N is a Cyclone® II family FPGA from Intel, delivered in a 256-LBGA package. It provides a programmable logic fabric with 18,752 logic elements and on-chip memory to support low-cost embedded processing and DSP-focused applications.

With support for 152 I/O pins, multi-volt I/O interfaces and a core supply range of 1.15 V to 1.25 V, this commercial-grade device is intended for designs that require compact packaging, flexible I/O and integrated logic-plus-memory capability within a standard commercial temperature range.

Key Features

• Logic Capacity  18,752 logic elements to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs and small embedded data stores.
• I/O Density & Flexibility  152 I/O pins with support for advanced I/O standards and high-speed differential interfaces as described in the Cyclone II device documentation.
• Power  Core voltage supply range of 1.15 V to 1.25 V to match system power rails and design constraints.
• Package & Mounting  256-LBGA (supplier package listed as 256-FBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Operating Range  Commercial-grade device with an operating temperature range from 0 °C to 85 °C.
• Standards & Design Support  Family documentation includes configuration, clocking, PLLs, embedded multipliers, external memory interfacing and JTAG support to assist system integration and testing.
• RoHS Compliant  Device meets RoHS requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Embedded Processing  Low-cost embedded processing solutions leveraging the Cyclone II architecture and on-chip logic and memory.
• DSP Acceleration  Low-cost DSP solutions utilizing the family’s DSP-oriented features and embedded multipliers noted in the device documentation.
• High-Speed I/O Systems  Systems requiring high-speed differential interfaces and flexible I/O banks for signal interfacing and protocol bridging.
• External Memory Interfaces  Designs that require external memory connectivity, supported by the Cyclone II external memory interfacing guidance in the datasheet.

Unique Advantages

• High logic density: 18,752 logic elements provide substantial programmable resources for compact digital designs.
• Integrated on-chip RAM: Approximately 0.24 Mbits of embedded memory reduces external memory dependence for buffering and local storage.
• Flexible I/O count and standards: 152 I/O pins and documented support for advanced I/O standards enable diverse interface options.
• Compact, surface-mount package: 256-LBGA (17×17 supplier FBGA outline) offers a small PCB footprint for space-constrained designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments.
• Comprehensive family documentation: Detailed Cyclone II device handbook content on configuration, clock networks, PLLs, multipliers and memory simplifies integration and verification.

Why Choose EP2C20F256C6N?

The EP2C20F256C6N combines a mid-range logic element count with embedded RAM, flexible I/O and a compact 256-LBGA package, positioning it for commercial designs that demand integrated logic and memory in a small form factor. Its documented family features—covering configuration, clocking, multipliers and external memory interfacing—support development of low-cost embedded processing and DSP applications.

For engineering teams and product developers seeking a commercial-grade Cyclone II FPGA with verified device documentation and RoHS compliance, the EP2C20F256C6N offers a balanced mix of capacity, I/O flexibility and package density for scalable board-level integration.

Request a quote or submit an RFQ to begin procurement and receive pricing and availability for EP2C20F256C6N.