EP2C20AF256I8NES

The EP2C20AF256I8NES is a Cyclone® II Field Programmable Gate Array (FPGA) optimized for industrial embedded designs. It provides a programmable fabric with 18,752 logic elements, substantial on-chip RAM, and 152 I/O pins in a compact 256-ball BGA package.

Designed for systems that require flexible logic integration and robust environmental tolerance, this FPGA combines mid-range logic capacity with a low-voltage core supply and an industrial operating temperature range for reliable deployment in demanding applications.

Key Features

• Logic Capacity  18,752 logic elements for implementing custom digital logic, state machines, and glue-logic functions.
• Embedded Memory  239,616 bits of on-chip RAM (approximately 0.24 Mbits) to support buffers, FIFOs, and small memory structures without external RAM.
• I/O Count  152 general-purpose I/O pins to interface with sensors, peripherals, and external buses.
• Power  Core voltage range of 1.15 V to 1.25 V to support low-voltage system designs.
• Package and Mounting  256-LBGA package (supplier package listed as 256-FBGA, 17×17) with surface-mount mounting for board-level integration in compact layouts.
• Operating Range  Industrial temperature rating from -40 °C to 100 °C for operation in harsh environments.
• Compliance  RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation, and protocol bridging where industrial temperature tolerance and a sizable I/O count are required.
• Embedded Systems  Integrate bespoke processing blocks, glue logic, and peripheral interfaces using the FPGA’s logic capacity and on-chip RAM.
• Communications Interfaces  Create protocol converters, I/O serializers/deserializers, and interface glue between system peripherals and higher-level controllers.

Unique Advantages

• Substantial Logic Density:  18,752 logic elements provide the headroom to implement complex custom logic without resorting to multiple discrete devices, reducing BOM complexity.
• On-Chip Memory for Real-Time Tasks:  Approximately 0.24 Mbits of embedded RAM supports buffering and small data structures directly on-chip, improving latency and simplifying board-level memory design.
• Generous I/O Count:  152 I/Os facilitate direct connections to sensors, actuators, and external controllers, minimizing the need for additional I/O expanders.
• Industrial Temperature Range:  Rated from -40 °C to 100 °C for deployment in environments with wide temperature variations.
• Compact BGA Package:  256-LBGA (256-FBGA, 17×17) enables high-density PCB layouts while maintaining reliable soldered connections for surface-mount assembly.
• RoHS Compliant:  Meets environmental regulations for lead-free manufacturing processes.

Why Choose EP2C20AF256I8NES?

The EP2C20AF256I8NES offers a balanced combination of logic capacity, on-chip memory, and I/O resources in a compact, industrial-grade package. It is well suited to engineers designing industrial embedded systems, communication interfaces, and custom logic applications that demand durable components and flexible configurability.

With its low-voltage core range and surface-mount BGA packaging, this FPGA supports compact, energy-conscious board designs while providing the robustness required for extended temperature operation.

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