EP2C20AF484A7N

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

Quantity 1,955 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits239616

Overview of EP2C20AF484A7N – Cyclone® II FPGA, 484-BGA

The EP2C20AF484A7N is an Intel Cyclone® II Field Programmable Gate Array (FPGA) supplied in a 484-ball FBGA (23 × 23) package. It integrates 18,752 logic elements organized across 1,172 logic blocks, approximately 0.24 Mbits of embedded memory (239,616 total RAM bits), and 315 I/O pins, offering a compact, configurable fabric for embedded processing and DSP-oriented designs.

Designed for applications requiring programmable logic with on-chip memory and flexible I/O, this device supports a 1.15 V to 1.25 V core supply and operates from −40 °C to 125 °C. The device is RoHS compliant and carries an AEC‑Q100 qualification for automotive-grade deployment.

Key Features

  • Logic Capacity — 18,752 logic elements arranged across 1,172 logic blocks to implement custom logic, control, and signal-processing functions.
  • Embedded Memory — Approximately 0.24 Mbits (239,616 bits) of on-chip RAM for lookup tables, FIFOs, and local data buffering.
  • I/O Density and Flexibility — 315 I/O pins in a 484-FBGA (23×23) package to support a wide range of parallel interfaces and external peripheral connections.
  • Supply and Power — Core voltage range of 1.15 V to 1.25 V for predictable power delivery and integration into regulated power systems.
  • Automotive Qualification — AEC‑Q100 qualification and operating temperature range of −40 °C to 125 °C for automotive and other harsh-environment applications.
  • Package and Mounting — 484-ball surface-mount FBGA (23×23) package optimized for high-density boards and automated assembly.
  • Standards and Compliance — RoHS compliant, aligning with restricted-substance requirements for modern electronic systems.
  • Architectural Capabilities (from Cyclone II family) — Device architecture includes features such as global clock networks, PLL support, embedded multiplier and memory blocks, and flexible I/O standards to enable synchronous designs and high-efficiency signal processing.

Typical Applications

  • Embedded Processing — Implement custom control, state machines, and embedded compute functions with on-chip logic and memory.
  • Digital Signal Processing — Use the device’s logic and embedded resources for low-cost DSP tasks and data-path acceleration.
  • High‑Pin‑Count Peripheral Interfaces — Leverage 315 I/Os to interface with sensors, memory devices, or parallel data busses in compact systems.
  • Automotive Electronics — AEC‑Q100 qualification and extended temperature range make the device suitable for selected automotive control and data-processing modules.

Unique Advantages

  • Ample Logic Resources: 18,752 logic elements provide a substantial logic fabric for mid-range programmable designs without external ASIC development.
  • On‑Chip Memory: Approximately 0.24 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup operations, simplifying board design.
  • High I/O Count in Compact Package: 315 I/Os in a 484-FBGA enable dense connectivity while maintaining a small PCB footprint.
  • AEC‑Q100 Qualified: Automotive qualification and −40 °C to 125 °C operation support deployment in temperature-demanding and automotive environments.
  • Flexible Power Integration: Narrow core voltage range (1.15 V–1.25 V) simplifies power-supply planning and regulation for the FPGA core.
  • Compliance and Manufacturing Compatibility: RoHS compliance and standard surface-mount FBGA packaging ensure compatibility with modern assembly processes and regulatory requirements.

Why Choose EP2C20AF484A7N?

The EP2C20AF484A7N delivers a balanced combination of logic density, on-chip memory, and I/O capability in a 484-FBGA package, targeted at designs that require flexible programmable logic and reliable operation across a wide temperature range. Its AEC‑Q100 qualification and RoHS compliance make it suitable for automotive and other demanding system applications where long-term robustness and regulatory compliance matter.

This device is a practical option for engineers developing embedded controllers, data-path accelerators, and interface-heavy systems that benefit from the Cyclone II family architecture, including integrated clocking, memory blocks, and multiplier resources.

Request a quote or submit an inquiry to receive pricing and availability information for the EP2C20AF484A7N and discuss how it can fit your next design.

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