EP2C20AF484A7N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA |
|---|---|
| Quantity | 1,955 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 315 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1172 | Number of Logic Elements/Cells | 18752 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 239616 |
Overview of EP2C20AF484A7N – Cyclone® II FPGA, 484-BGA
The EP2C20AF484A7N is an Intel Cyclone® II Field Programmable Gate Array (FPGA) supplied in a 484-ball FBGA (23 × 23) package. It integrates 18,752 logic elements organized across 1,172 logic blocks, approximately 0.24 Mbits of embedded memory (239,616 total RAM bits), and 315 I/O pins, offering a compact, configurable fabric for embedded processing and DSP-oriented designs.
Designed for applications requiring programmable logic with on-chip memory and flexible I/O, this device supports a 1.15 V to 1.25 V core supply and operates from −40 °C to 125 °C. The device is RoHS compliant and carries an AEC‑Q100 qualification for automotive-grade deployment.
Key Features
- Logic Capacity — 18,752 logic elements arranged across 1,172 logic blocks to implement custom logic, control, and signal-processing functions.
- Embedded Memory — Approximately 0.24 Mbits (239,616 bits) of on-chip RAM for lookup tables, FIFOs, and local data buffering.
- I/O Density and Flexibility — 315 I/O pins in a 484-FBGA (23×23) package to support a wide range of parallel interfaces and external peripheral connections.
- Supply and Power — Core voltage range of 1.15 V to 1.25 V for predictable power delivery and integration into regulated power systems.
- Automotive Qualification — AEC‑Q100 qualification and operating temperature range of −40 °C to 125 °C for automotive and other harsh-environment applications.
- Package and Mounting — 484-ball surface-mount FBGA (23×23) package optimized for high-density boards and automated assembly.
- Standards and Compliance — RoHS compliant, aligning with restricted-substance requirements for modern electronic systems.
- Architectural Capabilities (from Cyclone II family) — Device architecture includes features such as global clock networks, PLL support, embedded multiplier and memory blocks, and flexible I/O standards to enable synchronous designs and high-efficiency signal processing.
Typical Applications
- Embedded Processing — Implement custom control, state machines, and embedded compute functions with on-chip logic and memory.
- Digital Signal Processing — Use the device’s logic and embedded resources for low-cost DSP tasks and data-path acceleration.
- High‑Pin‑Count Peripheral Interfaces — Leverage 315 I/Os to interface with sensors, memory devices, or parallel data busses in compact systems.
- Automotive Electronics — AEC‑Q100 qualification and extended temperature range make the device suitable for selected automotive control and data-processing modules.
Unique Advantages
- Ample Logic Resources: 18,752 logic elements provide a substantial logic fabric for mid-range programmable designs without external ASIC development.
- On‑Chip Memory: Approximately 0.24 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup operations, simplifying board design.
- High I/O Count in Compact Package: 315 I/Os in a 484-FBGA enable dense connectivity while maintaining a small PCB footprint.
- AEC‑Q100 Qualified: Automotive qualification and −40 °C to 125 °C operation support deployment in temperature-demanding and automotive environments.
- Flexible Power Integration: Narrow core voltage range (1.15 V–1.25 V) simplifies power-supply planning and regulation for the FPGA core.
- Compliance and Manufacturing Compatibility: RoHS compliance and standard surface-mount FBGA packaging ensure compatibility with modern assembly processes and regulatory requirements.
Why Choose EP2C20AF484A7N?
The EP2C20AF484A7N delivers a balanced combination of logic density, on-chip memory, and I/O capability in a 484-FBGA package, targeted at designs that require flexible programmable logic and reliable operation across a wide temperature range. Its AEC‑Q100 qualification and RoHS compliance make it suitable for automotive and other demanding system applications where long-term robustness and regulatory compliance matter.
This device is a practical option for engineers developing embedded controllers, data-path accelerators, and interface-heavy systems that benefit from the Cyclone II family architecture, including integrated clocking, memory blocks, and multiplier resources.
Request a quote or submit an inquiry to receive pricing and availability information for the EP2C20AF484A7N and discuss how it can fit your next design.

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