EP2C20F256C6

The EP2C20F256C6 is a Cyclone® II field-programmable gate array (FPGA) in a 256-LBGA package, designed for cost-sensitive embedded and DSP-oriented designs. It implements the Cyclone II architecture documented in the Cyclone II Device Handbook and is optimized for applications that require a balance of logic capacity, embedded memory, and flexible I/O.

With 18,752 logic elements, approximately 0.24 Mbits of on-chip RAM and 152 user I/O pins, this device targets embedded processing and low-cost DSP use cases where integration, predictable power rails, and commercial-temperature operation are key considerations.

Key Features

• Cyclone II Architecture Architecture and device family documentation are provided in the Cyclone II Device Handbook, covering logic, clocking, memory and I/O structures.
• Logic Capacity 18,752 logic elements to implement custom digital logic, control functions and embedded processing blocks.
• Embedded Memory Total on-chip RAM of 239,616 bits (approximately 0.24 Mbits) for data buffering, FIFOs and small embedded storage.
• I/O and Interface Flexibility 152 user I/O pins for peripheral interfacing and external memory connections, with support for the I/O structure described in the device handbook.
• Clocking and DSP Support Device family documentation includes sections on global clock networks and phase-locked loops (PLLs), and on embedded multipliers and DSP-oriented features.
• Power and Supply Core supply voltage range of 1.15 V to 1.25 V for the device core.
• Package and Mounting 256-LBGA package; supplier device package listed as 256-FBGA (17 × 17). Surface-mount mounting type.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C and specified as commercial grade.
• Regulatory RoHS compliant.

Typical Applications

• Embedded Processing Implement control logic, soft processors or glue logic where integrated logic and local RAM simplify board-level design.
• Low‑Cost DSP Functions Use embedded multipliers and on-chip memory resources for compact DSP engines and signal-processing tasks.
• Custom I/O and Interface Bridging Leverage 152 I/O pins to build protocol converters, bus bridges or specialized peripheral interfaces.
• Prototyping and System Integration Ideal for evaluating custom logic functions and integrating multiple digital functions into a single programmable device.

Unique Advantages

• Balanced Logic and Memory: 18,752 logic elements with approximately 0.24 Mbits of embedded RAM provide a practical mix for control, DSP and glue-logic designs.
• Flexible I/O Count: 152 user I/Os enable extensive peripheral connectivity without immediate need for external I/O expanders.
• Documented Architecture: Comprehensive device family documentation (Cyclone II Device Handbook) covers architecture, clocking, memory and I/O details to support design and verification.
• Compact Package: 256-LBGA (supplier 256-FBGA 17 × 17) surface-mount package simplifies board layout for space-constrained designs.
• Controlled Power Rail: Defined core supply range (1.15 V to 1.25 V) supports predictable power budgeting and system-level power planning.
• RoHS Compliant: Environmentally compliant manufacturing readiness.

Why Choose EP2C20F256C6?

The EP2C20F256C6 positions itself as a practical Cyclone II FPGA option when you need a well-documented, commercially graded programmable device with substantial logic capacity and on-chip memory. Its combination of 18,752 logic elements, roughly 0.24 Mbits of embedded RAM and 152 I/O pins makes it suitable for embedded processing, DSP tasks and interface integration where cost and board space are important factors.

Backed by Cyclone II family documentation, the EP2C20F256C6 offers engineers the design visibility needed for implementation and verification, making it a sensible choice for teams developing compact, programmable digital solutions with clear supply and temperature specifications.

Request a quote or contact sales to discuss availability, lead times and volume pricing for EP2C20F256C6.