EP2C20F256C7N

The EP2C20F256C7N is a commercial-grade Cyclone® II FPGA from Intel, delivered in a 256-LBGA surface-mount package. The device integrates programmable logic, embedded memory and I/O to address low-cost embedded processing and DSP-oriented applications described in the Cyclone II device handbook.

With 18,752 logic elements, approximately 0.24 Mbits of on-chip RAM and 152 user I/O pins, this part supports compact, cost-sensitive designs that require flexible logic implementation, on-chip storage and multi‑I/O interfacing within a 1.15–1.25 V core supply and a 0 °C to 85 °C operating range.

Key Features

• Programmable Logic Capacity  18,752 logic elements provide substantial fabric for implementing custom logic, control and data-path functions.
• Embedded Memory  Approximately 0.24 Mbits of total on-chip RAM for data buffering, FIFOs and small on-chip storage structures.
• I/O Count & Flexibility  152 user I/O pins enable broad peripheral interfacing and external bus connectivity in a single-package solution.
• Package & Mounting  256-LBGA package (supplier device package: 256-FBGA, 17 × 17 mm) designed for surface-mount assembly in compact board layouts.
• Power & Operating Conditions  Core supply range of 1.15 V to 1.25 V and commercial-grade operating temperature from 0 °C to 85 °C to match typical embedded system environments.
• Series Architecture Documentation  Cyclone II device handbook documents architecture elements such as global clock networks, phase-locked loops (PLLs), embedded multipliers, memory modes and configuration options to aid design integration.
• Compliance  RoHS-compliant construction supports environmental compliance requirements for modern electronics manufacturing.

Typical Applications

• Embedded Processing  Implement control logic, soft processors or peripheral aggregation in compact embedded systems where on-chip memory and programmable logic reduce external components.
• Low-Cost DSP Functions  Use the series’ documented embedded multipliers and routing resources to implement fixed-point DSP kernels and signal processing blocks for cost-sensitive designs.
• Custom I/O Interfaces  Leverage 152 user I/Os to bridge disparate peripherals, implement protocol translators or create custom host interfaces on a single device.

Unique Advantages

• Substantial Logic Density: 18,752 logic elements enable integration of multiple functions—reducing board-level BOM and interconnect complexity.
• On-Chip RAM for System Efficiency: Approximately 0.24 Mbits of embedded memory supports buffering and localized data storage to improve throughput and lower external memory needs.
• Documented Architecture: Cyclone II handbook coverage of clocks, PLLs, embedded multipliers and memory modes helps accelerate design implementation and validation.
• Compact, Surface-Mount Package: 256-LBGA (17 × 17 mm supplier FBGA) simplifies high-density PCB designs while keeping routing and placement manageable.
• Commercial Temperature and Power Profile: 0 °C to 85 °C operating range and 1.15–1.25 V core supply align with common commercial embedded system requirements.
• RoHS Compliant: Meets lead-free and restricted-substance expectations for modern manufacturing processes.

Why Choose EP2C20F256C7N?

The EP2C20F256C7N positions itself as a practical FPGA choice for engineers targeting cost-sensitive embedded and DSP applications that require moderate logic density, on-chip memory and plentiful I/O in a compact surface-mount package. Its documented Cyclone II architecture elements—such as clocking resources, PLLs, embedded multipliers and configurable memory modes—provide the design detail needed to integrate the device into systems reliably.

This device is well suited for development teams and procurement organizations seeking a commercially graded, RoHS-compliant FPGA with a balanced combination of logic, memory and I/O for mid-range embedded projects. The Cyclone II series documentation supports design scalability and system-level planning throughout product development.

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