EP2C20F256I8N

The EP2C20F256I8N is a Cyclone II family field programmable gate array (FPGA) provided by Intel. It implements approximately 18,752 logic elements and integrates on-chip memory and programmable I/O to support a range of embedded logic functions.

This device targets designs that require a balance of logic capacity, embedded memory, and flexible I/O in a surface-mount 256-pin BGA package, with industrial-grade temperature capability and RoHS compliance.

Key Features

• Logic Capacity  Approximately 18,752 logic elements for implementing combinational and sequential logic.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 bits) for buffering, FIFOs, and local storage.
• I/O and Package  152 user I/O pins in a 256-LBGA package; supplier device package listed as 256-FBGA (17×17); surface-mount mounting.
• Core Power  Core supply range 1.15 V to 1.25 V for device operation.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Cyclone II Architecture  Built on the Cyclone II family architecture with features described in the Cyclone II Device Handbook, including global clock networks, phase-locked loops (PLLs), embedded multipliers, and flexible memory and I/O structures.
• Configuration & Test Support  Includes configuration and testing features such as IEEE 1149.1 (JTAG) boundary-scan support as documented in the Cyclone II handbook.
• Compliance  RoHS compliant.

Typical Applications

• Low-cost embedded processing  Implements custom control and processing logic using on-chip memory and logic elements to replace or augment fixed-function ASICs.
• Low-cost DSP solutions  Supports digital signal processing building blocks using the Cyclone II architecture’s embedded multipliers and memory resources.
• Memory interface and buffering  On-chip RAM and flexible I/O allow the device to act as an interface or buffer between system elements and external memory or peripherals.

Unique Advantages

• Balanced logic and memory resources:  Approximately 18,752 logic elements combined with ~0.24 Mbits of embedded memory enable a wide range of custom logic and buffering functions without external SRAM for many use cases.
• Compact, manufacturable package:  256-LBGA (supplier package 256-FBGA, 17×17) in a surface-mount form factor simplifies high-density PCB layouts.
• Industrial reliability:  Rated for −40 °C to 100 °C operation to meet industrial temperature requirements.
• Flexible I/O count:  152 I/O pins provide broad interfacing options for peripherals, memory, and system signals.
• Power domain clarity:  Defined core voltage range (1.15–1.25 V) supports consistent power design and supply planning.
• Documented architecture and tooling support:  Extensive Cyclone II device handbook material covers architecture, configuration, timing, and I/O, aiding integration and verification.

Why Choose EP2C20F256I8N?

The EP2C20F256I8N delivers a practical combination of logic density, embedded memory, and I/O resources in the Cyclone II family form factor. Its industrial temperature rating and RoHS compliance make it suitable for designs that require reliable operation across a wide thermal range while maintaining manufacturability in a compact BGA package.

This device is well suited to engineers and teams implementing programmable logic for embedded control, DSP blocks, or memory-interface functions who need documented architecture and configuration support from the Cyclone II device handbook.

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