EP2C20F484C6N

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

Quantity 1,098 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C20F484C6N – Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

The EP2C20F484C6N is a Cyclone® II family FPGA from Intel, providing a moderate-density, reprogrammable logic platform for commercial embedded designs. Based on Cyclone II architecture, this device is suitable for low-cost embedded processing and DSP-focused solutions where a balanced combination of logic resources, embedded memory, and I/O capacity is required.

Key hardware characteristics include 18,752 logic elements, approximately 0.24 Mbits of embedded RAM, 315 I/O pins, and a 484-ball FBGA (23×23) surface-mount package. The device operates from a 1.15–1.25 V core supply and across a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 18,752 logic elements to implement custom digital functions, control logic, and moderate-complexity state machines.
  • Logic Array Blocks (LABs) — 1,172 LABs for organized placement of logic resources and predictable routing architecture.
  • Embedded Memory — Approximately 0.24 Mbits of on-chip RAM for buffering, FIFOs, and small data tables.
  • I/O Resources — 315 user I/O pins to support multiple interfaces and parallel connections to peripherals and memory.
  • Package & Mounting — 484-FBGA (23×23) surface-mount package providing a compact footprint for board-level integration.
  • Power & Supply — Core voltage range of 1.15 V to 1.25 V to match Cyclone II power requirements and system supply planning.
  • Operating Range & Grade — Commercial grade operation from 0 °C to 85 °C and RoHS-compliant construction.
  • Documentation Support — Supported by the Cyclone II Device Handbook and detailed device documentation for architecture, configuration, and timing guidance.

Typical Applications

  • Embedded Processing — Implement control logic, custom processors, and glue logic for consumer and commercial electronic products.
  • DSP Acceleration — Offload signal-processing functions within cost-sensitive designs using the Cyclone II architecture.
  • Interfaces & Bridging — Serve as protocol bridges or parallel/serial interface controllers leveraging the device's 315 I/Os.
  • Custom Peripheral Control — Manage sensors, user interfaces, and actuator control where moderate logic and embedded RAM are sufficient.

Unique Advantages

  • Substantial Logic Density: 18,752 logic elements provide room for sizable custom logic implementations without moving to higher-tier devices.
  • On-Chip Memory: Approximately 0.24 Mbits of embedded RAM reduces external memory needs for many buffering and small-data applications.
  • High I/O Count: 315 user I/Os enable flexible connectivity for multiple peripherals, buses, and memory interfaces.
  • Compact FBGA Package: 484-ball FBGA (23×23) footprint optimizes board area while delivering substantial I/O and routing resources.
  • Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream electronics.
  • Established Documentation: Backed by the Cyclone II device handbook and device-specific documentation for design and timing guidance.

Why Choose EP2C20F484C6N?

The EP2C20F484C6N positions itself as a practical choice for commercial embedded designs that require a balanced mix of logic resources, embedded RAM, and extensive I/O in a compact FBGA package. Its Cyclone II architecture and available documentation make it suitable for implementers who need predictable routing and architecture behavior for control, interface, and DSP-leaning tasks.

Design teams targeting cost-conscious systems with moderate logic complexity will find this device offers an appropriate combination of integration, I/O flexibility, and supplier-backed documentation to support development and deployment.

Request a quote or contact sales to discuss availability, lead times, and evaluation options for EP2C20F484C6N.

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