EP2C20F484C7

The EP2C20F484C7 is an Intel Cyclone® II field programmable gate array (FPGA) supplied in a 484-ball fine-pitch BGA (23×23) package for surface-mount assembly. It delivers 18,752 logic elements and a flexible I/O fabric for commercial-grade embedded logic and DSP-oriented applications.

Targeted for low-cost embedded processing and DSP solutions, this device combines a compact BGA package with on-chip memory and a broad I/O count, enabling integration of control, interface, and processing functions in space-constrained designs.

Key Features

• Logic Capacity — 18,752 logic elements suitable for medium-complexity programmable logic designs.
• Embedded Memory — Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for local buffering, FIFOs, and small data stores.
• High I/O Count — 315 general-purpose I/O pins to support multiple parallel interfaces and peripheral connections.
• Power Supply — Core voltage range of 1.15 V to 1.25 V to match Cyclone II core requirements.
• Package & Mounting — 484‑FBGA (23×23) package in a surface-mount form factor for compact PCB layouts.
• Commercial Grade & Temperature Range — Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• Family Capabilities — Cyclone II device family features documented support for global clock networks, phase-locked loops (PLLs), embedded multipliers, and configurable I/O structures, enabling common FPGA design needs.
• Environmental Compliance — RoHS compliant for environmentally conscious manufacturing and assembly.

Typical Applications

• Embedded Processing — Implement compact processor peripherals, glue logic, and control paths using the Cyclone II architecture and available on-chip RAM.
• DSP Functions — Implement fixed-point DSP blocks and data-path logic leveraging Cyclone II family support for embedded multipliers and memory resources.
• I/O-Intensive Control Systems — Support multiple parallel interfaces, sensor arrays, and peripheral buses with 315 I/O pins.
• Prototyping and OEM Integration — Use the 484‑BGA package and surface-mount mounting for space-constrained prototype boards and volume products with commercial temperature requirements.

Unique Advantages

• Substantial Logic Density: 18,752 logic elements enable integration of multiple functions into a single FPGA, reducing external component count.
• On-Chip Memory for Local Data Handling: Approximately 0.24 Mbits of embedded RAM supports FIFOs, small buffers, and state storage without external memory.
• High I/O Integration: 315 I/Os simplify system-level connectivity and help consolidate interfaces onto one device.
• Compact BGA Footprint: 484‑FBGA (23×23) package provides a tight PCB footprint for dense board designs while maintaining effective thermal and signal routing characteristics for surface-mount assembly.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for typical commercial deployments and general-purpose electronics applications.
• Vendor Documentation and Family Support: Part of the Cyclone II family with published device handbook and architecture guidance for design and configuration.

Why Choose EP2C20F484C7?

The EP2C20F484C7 balances a robust logic capacity and on-chip memory with a high I/O count in a compact 484‑BGA package, making it well suited for commercial embedded and DSP-focused designs that require integration and board-space efficiency. Its Cyclone II family features—documented support for clocking resources, embedded multipliers, and configurable I/O—support a wide range of programmable logic implementations.

This device is appropriate for engineering teams seeking a commercially rated FPGA from Intel with clear technical documentation and family-level resources to accelerate design, verification, and deployment in medium-complexity systems.

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