EP2C20F484C8

The EP2C20F484C8 is a Cyclone II family FPGA from Intel, delivered in a 484-ball FBGA (23×23) package for surface-mount applications. It integrates 18,752 logic elements and approximately 0.24 Mbits of on-chip RAM, providing a mid-density programmable fabric for embedded processing and digital signal tasks.

With 315 user I/O pins, a supply voltage range of 1.15 V to 1.25 V, and a commercial operating temperature range of 0 °C to 85 °C, this device is intended for general-purpose, commercial-grade FPGA designs that require a balance of logic density, memory, and I/O count in a compact BGA footprint.

Key Features

• Logic Capacity  18,752 logic elements provide a mid-range implementation capacity for custom logic, state machines, and glue-logic functions.
• Logic Array Blocks (LABs)  1,172 LABs (logic array blocks) enable organized placement of logic and local routing consistent with Cyclone II architecture.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM for block memory requirements and small FIFOs.
• Flexible I/O  315 I/O pins supplied via a 484-FBGA (23×23) package suitable for multi-bank I/O configurations and external interfacing.
• Power  Core supply voltage range of 1.15 V to 1.25 V for the device core.
• Commercial Temperature Grade  Specified to operate from 0 °C to 85 °C for commercial applications.
• Package & Mounting  484-BGA, surface-mount package (484-FBGA, 23×23) for compact board-level integration.
• Standards & Documentation  Device is RoHS compliant and is covered by the Cyclone II Device Handbook and associated documentation for architecture, configuration, and timing.
• Cyclone II Architecture Features  The Cyclone II family documentation describes features such as global clock networks, phase-locked loops (PLLs), embedded multipliers, and programmable I/O structures that are available across the device family.

Typical Applications

• Embedded processing  Suitable for low-cost embedded processing solutions where programmable logic and on-chip memory implement custom control and data paths.
• Digital signal processing (DSP)  Appropriate for low-cost DSP solutions that leverage the Cyclone II architecture’s embedded resources and routing for custom arithmetic and signal pipelines.
• External memory interfaces  Used in designs requiring flexible external memory interfacing and programmable I/O arrangements as described in the Cyclone II documentation.

Unique Advantages

• Balanced logic and memory capacity: 18,752 logic elements paired with approximately 0.24 Mbits of embedded RAM enable a wide range of mid-density designs.
• High I/O count in a compact package: 315 I/Os in a 484-FBGA (23×23) footprint support complex external interfacing while minimizing board area.
• Documented architecture: Backed by the Cyclone II Device Handbook with detailed information on logic array blocks, clocking, configuration, and I/O structures.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C to meet common commercial application requirements.
• RoHS compliance: Conforms to environmental requirements for lead-free manufacturing.
• Standard BGA mounting: Surface-mount 484-FBGA package supports conventional PCB assembly processes.

Why Choose EP2C20F484C8?

The EP2C20F484C8 delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 484-FBGA package, aligned with the Cyclone II device family architecture. It is a suitable choice for engineers designing commercial embedded processing and DSP solutions that require mid-range programmable logic, documented architectural behavior, and a commercial operating temperature range.

Designers benefit from the device’s clear, published device handbook coverage for architecture, configuration, and timing, enabling predictable integration into systems that need a balance of resources and a compact board-level footprint.

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