EP2C20F484C6

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

Quantity 951 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C20F484C6 – Cyclone® II FPGA, 18,752 Logic Elements, 484-BGA

The EP2C20F484C6 is a Cyclone® II field programmable gate array (FPGA) from Intel, offering a balanced combination of logic density, embedded memory, and I/O for low-cost embedded processing and DSP-focused designs. Built on the Cyclone II device family architecture, it targets applications that require moderate logic resources, on-chip RAM, and flexible I/O in a compact 484-ball BGA package.

Key attributes include 18,752 logic elements, approximately 0.24 Mbits of embedded memory, 315 user I/O pins, a 484-FBGA (23×23) package, and a 1.15–1.25 V core supply operating across a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic Capacity  18,752 logic elements provide the programmable fabric required for combinational and sequential logic implementation in embedded control and DSP tasks.
  • Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs, and small on-chip data storage.
  • I/O Resources  315 user I/O pins support a wide range of interfacing needs and external device connectivity.
  • Clocking and Timing  Cyclone II family architecture includes a global clock network and PLL support for flexible clock distribution and phase-locked loop clock management.
  • Embedded DSP Support  Family-level support for embedded multipliers and DSP-oriented routing helps implement arithmetic and signal-processing functions efficiently.
  • Configuration & Test  JTAG boundary-scan and standard Cyclone II configuration/testing features are supported for device programming and validation.
  • Package & Mounting  484-ball FBGA (23×23) surface-mount package provides a compact footprint suitable for space-constrained PCBs.
  • Power & Temperature  Core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • Low-Cost Embedded Processing  Implement microcontroller-like control logic, peripheral glue, and custom state machines within embedded systems while minimizing external components.
  • DSP and Signal Processing  Use the device’s embedded multipliers and on-chip memory for small to medium-scale digital signal-processing tasks.
  • High-Density I/O Interfacing  Leverage 315 I/O pins for sensor aggregation, parallel interfaces, and external memory/controller interfacing in compact systems.
  • Prototyping and Custom Logic  Rapidly implement and iterate custom logic blocks, IP cores, and peripheral interfaces for evaluation and production designs.

Unique Advantages

  • Highly integrated programmable fabric: 18,752 logic elements combined with on-chip RAM reduce dependency on external logic and memory for many embedded functions.
  • Balanced DSP capability: Family-level embedded multipliers and routing support enable efficient implementation of arithmetic and signal-processing blocks.
  • Generous I/O count in a compact package: 315 user I/Os in a 484-FBGA (23×23) package provide interface density while conserving board area.
  • Commercial-temperature operation: Rated for 0 °C to 85 °C, suitable for standard commercial electronics deployments.
  • Standard configuration and test support: Boundary-scan and Cyclone II configuration features simplify programming, validation, and in-system testing.
  • RoHS compliant: Manufactured to meet current RoHS environmental requirements.

Why Choose EP2C20F484C6?

The EP2C20F484C6 positions itself as a practical Cyclone II FPGA option for designers seeking a middle ground between logic density, embedded memory, and I/O capability in a compact BGA package. Its combination of 18,752 logic elements, approximately 0.24 Mbits of embedded RAM, and family-level DSP and clocking features make it suitable for cost-conscious embedded processing and signal-processing designs.

This device is well suited for engineering teams developing products that require flexible programmability, a substantial I/O count, and on-chip resources to minimize external components. As part of the Cyclone II device family, it benefits from the documented architecture and configuration features that support development, testing, and production deployment.

Request a quote or submit an inquiry to obtain pricing and availability for EP2C20F484C6 and to discuss how it can fit your next embedded or DSP design.

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