EP2C20F484C6
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA |
|---|---|
| Quantity | 951 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 315 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1172 | Number of Logic Elements/Cells | 18752 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP2C20F484C6 – Cyclone® II FPGA, 18,752 Logic Elements, 484-BGA
The EP2C20F484C6 is a Cyclone® II field programmable gate array (FPGA) from Intel, offering a balanced combination of logic density, embedded memory, and I/O for low-cost embedded processing and DSP-focused designs. Built on the Cyclone II device family architecture, it targets applications that require moderate logic resources, on-chip RAM, and flexible I/O in a compact 484-ball BGA package.
Key attributes include 18,752 logic elements, approximately 0.24 Mbits of embedded memory, 315 user I/O pins, a 484-FBGA (23×23) package, and a 1.15–1.25 V core supply operating across a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core Logic Capacity 18,752 logic elements provide the programmable fabric required for combinational and sequential logic implementation in embedded control and DSP tasks.
- Embedded Memory Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs, and small on-chip data storage.
- I/O Resources 315 user I/O pins support a wide range of interfacing needs and external device connectivity.
- Clocking and Timing Cyclone II family architecture includes a global clock network and PLL support for flexible clock distribution and phase-locked loop clock management.
- Embedded DSP Support Family-level support for embedded multipliers and DSP-oriented routing helps implement arithmetic and signal-processing functions efficiently.
- Configuration & Test JTAG boundary-scan and standard Cyclone II configuration/testing features are supported for device programming and validation.
- Package & Mounting 484-ball FBGA (23×23) surface-mount package provides a compact footprint suitable for space-constrained PCBs.
- Power & Temperature Core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS-compliant manufacturing status.
Typical Applications
- Low-Cost Embedded Processing Implement microcontroller-like control logic, peripheral glue, and custom state machines within embedded systems while minimizing external components.
- DSP and Signal Processing Use the device’s embedded multipliers and on-chip memory for small to medium-scale digital signal-processing tasks.
- High-Density I/O Interfacing Leverage 315 I/O pins for sensor aggregation, parallel interfaces, and external memory/controller interfacing in compact systems.
- Prototyping and Custom Logic Rapidly implement and iterate custom logic blocks, IP cores, and peripheral interfaces for evaluation and production designs.
Unique Advantages
- Highly integrated programmable fabric: 18,752 logic elements combined with on-chip RAM reduce dependency on external logic and memory for many embedded functions.
- Balanced DSP capability: Family-level embedded multipliers and routing support enable efficient implementation of arithmetic and signal-processing blocks.
- Generous I/O count in a compact package: 315 user I/Os in a 484-FBGA (23×23) package provide interface density while conserving board area.
- Commercial-temperature operation: Rated for 0 °C to 85 °C, suitable for standard commercial electronics deployments.
- Standard configuration and test support: Boundary-scan and Cyclone II configuration features simplify programming, validation, and in-system testing.
- RoHS compliant: Manufactured to meet current RoHS environmental requirements.
Why Choose EP2C20F484C6?
The EP2C20F484C6 positions itself as a practical Cyclone II FPGA option for designers seeking a middle ground between logic density, embedded memory, and I/O capability in a compact BGA package. Its combination of 18,752 logic elements, approximately 0.24 Mbits of embedded RAM, and family-level DSP and clocking features make it suitable for cost-conscious embedded processing and signal-processing designs.
This device is well suited for engineering teams developing products that require flexible programmability, a substantial I/O count, and on-chip resources to minimize external components. As part of the Cyclone II device family, it benefits from the documented architecture and configuration features that support development, testing, and production deployment.
Request a quote or submit an inquiry to obtain pricing and availability for EP2C20F484C6 and to discuss how it can fit your next embedded or DSP design.

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