EP2C20F256I8

IC FPGA 152 I/O 256FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 18752 256-LBGA

Quantity 195 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O152Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C20F256I8 – Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 18752 256-LBGA

The EP2C20F256I8 is an Intel Cyclone® II FPGA that delivers a mid-density programmable-logic solution for cost-sensitive embedded processing and DSP applications. Built on the Cyclone II architecture, this device combines approximately 18,752 logic elements with on-chip memory and a rich I/O complement to address control, interface and signal-processing functions.

With a 256-ball LBGA package (supplier device package listed as 256‑FBGA, 17×17), a 1.15 V–1.25 V core supply range and an industrial operating temperature range of −40 °C to 100 °C, the EP2C20F256I8 is suited for designs requiring compact, low-voltage programmable logic with documented Cyclone II family features such as embedded memory, multipliers, clocking and I/O flexibility.

Key Features

  • Logic Capacity — 18,752 logic elements (LEs) to implement combinational and sequential logic for glue logic, finite-state machines, and custom datapaths.
  • Embedded Memory — Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs and local data storage.
  • I/O Resources — 152 user I/O pins to support multiple peripherals, interfaces and board-level connections.
  • Cyclone II Architecture — Family-level features referenced in documentation include embedded multipliers, global clock network and phase-locked loops (PLLs), flexible I/O standards and dedicated memory blocks.
  • Power — Low-voltage core operation with a specified supply range of 1.15 V to 1.25 V to match system power budgets.
  • Package and Mounting — 256‑LBGA package in a surface-mount form factor; supplier device package listed as 256‑FBGA (17×17).
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Embedded Processing — Implement compact control and processing subsystems where low-cost, programmable logic is required for glue logic, peripherals and custom accelerators.
  • Digital Signal Processing — Support low-cost DSP tasks using on-chip memory and embedded multiplier resources referenced in Cyclone II documentation.
  • High‑Density I/O Interfaces — Serve as an interface bridge for external memory, sensors or peripherals using its 152 I/O pins and documented multi‑voltage I/O capabilities.
  • Industrial Control — Use in motor control, sensor aggregation and machine-control logic where the device’s industrial temperature range and surface-mount package are beneficial.

Unique Advantages

  • Balanced Logic and Memory: A combination of approximately 18,752 logic elements and roughly 0.24 Mbits of embedded RAM enables mid-range programmable designs without external SRAM for many functions.
  • Flexible I/O Count: 152 I/O pins provide broad connectivity options for mixed-signal front ends, sensor arrays and peripheral interfaces.
  • Low-Voltage Core: The 1.15 V–1.25 V supply range supports low-power core designs and helps integrate the FPGA into modern low-voltage systems.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet environmental demands of industrial applications.
  • Compact, Surface-Mount Package: 256‑LBGA (256‑FBGA, 17×17) packaging offers a compact footprint for space-constrained PCBs.
  • Documented Family-Level Features: Cyclone II family documentation details global clock networks, PLLs, embedded multipliers, and memory modes that support robust system-level design.

Why Choose EP2C20F256I8?

The EP2C20F256I8 positions itself as a mid-density FPGA choice within the Cyclone II family, delivering a practical balance of logic resources, embedded memory and plentiful I/O in a compact LBGA package. Its low core-voltage operation and industrial temperature rating make it appropriate for embedded and industrial designs that need on-board programmability combined with documented Cyclone II architecture features.

Designers seeking a programmable, cost-conscious solution with a clear set of family-level capabilities and thorough documentation will find the EP2C20F256I8 suitable for tasks ranging from embedded control and interface bridging to low-cost DSP and signal handling.

Request a quote or submit a pricing and availability inquiry to begin integrating the EP2C20F256I8 into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up