EP2C20F256I8
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 18752 256-LBGA |
|---|---|
| Quantity | 195 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 152 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1172 | Number of Logic Elements/Cells | 18752 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP2C20F256I8 – Cyclone® II Field Programmable Gate Array (FPGA) IC 152 239616 18752 256-LBGA
The EP2C20F256I8 is an Intel Cyclone® II FPGA that delivers a mid-density programmable-logic solution for cost-sensitive embedded processing and DSP applications. Built on the Cyclone II architecture, this device combines approximately 18,752 logic elements with on-chip memory and a rich I/O complement to address control, interface and signal-processing functions.
With a 256-ball LBGA package (supplier device package listed as 256‑FBGA, 17×17), a 1.15 V–1.25 V core supply range and an industrial operating temperature range of −40 °C to 100 °C, the EP2C20F256I8 is suited for designs requiring compact, low-voltage programmable logic with documented Cyclone II family features such as embedded memory, multipliers, clocking and I/O flexibility.
Key Features
- Logic Capacity — 18,752 logic elements (LEs) to implement combinational and sequential logic for glue logic, finite-state machines, and custom datapaths.
- Embedded Memory — Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs and local data storage.
- I/O Resources — 152 user I/O pins to support multiple peripherals, interfaces and board-level connections.
- Cyclone II Architecture — Family-level features referenced in documentation include embedded multipliers, global clock network and phase-locked loops (PLLs), flexible I/O standards and dedicated memory blocks.
- Power — Low-voltage core operation with a specified supply range of 1.15 V to 1.25 V to match system power budgets.
- Package and Mounting — 256‑LBGA package in a surface-mount form factor; supplier device package listed as 256‑FBGA (17×17).
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory — RoHS compliant.
Typical Applications
- Embedded Processing — Implement compact control and processing subsystems where low-cost, programmable logic is required for glue logic, peripherals and custom accelerators.
- Digital Signal Processing — Support low-cost DSP tasks using on-chip memory and embedded multiplier resources referenced in Cyclone II documentation.
- High‑Density I/O Interfaces — Serve as an interface bridge for external memory, sensors or peripherals using its 152 I/O pins and documented multi‑voltage I/O capabilities.
- Industrial Control — Use in motor control, sensor aggregation and machine-control logic where the device’s industrial temperature range and surface-mount package are beneficial.
Unique Advantages
- Balanced Logic and Memory: A combination of approximately 18,752 logic elements and roughly 0.24 Mbits of embedded RAM enables mid-range programmable designs without external SRAM for many functions.
- Flexible I/O Count: 152 I/O pins provide broad connectivity options for mixed-signal front ends, sensor arrays and peripheral interfaces.
- Low-Voltage Core: The 1.15 V–1.25 V supply range supports low-power core designs and helps integrate the FPGA into modern low-voltage systems.
- Industrial Temperature Capability: Rated from −40 °C to 100 °C to meet environmental demands of industrial applications.
- Compact, Surface-Mount Package: 256‑LBGA (256‑FBGA, 17×17) packaging offers a compact footprint for space-constrained PCBs.
- Documented Family-Level Features: Cyclone II family documentation details global clock networks, PLLs, embedded multipliers, and memory modes that support robust system-level design.
Why Choose EP2C20F256I8?
The EP2C20F256I8 positions itself as a mid-density FPGA choice within the Cyclone II family, delivering a practical balance of logic resources, embedded memory and plentiful I/O in a compact LBGA package. Its low core-voltage operation and industrial temperature rating make it appropriate for embedded and industrial designs that need on-board programmability combined with documented Cyclone II architecture features.
Designers seeking a programmable, cost-conscious solution with a clear set of family-level capabilities and thorough documentation will find the EP2C20F256I8 suitable for tasks ranging from embedded control and interface bridging to low-cost DSP and signal handling.
Request a quote or submit a pricing and availability inquiry to begin integrating the EP2C20F256I8 into your next design.

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