EP2C20F256C8N

The EP2C20F256C8N is a Cyclone® II field programmable gate array (FPGA) in a 256-ball LBGA package, offering a balance of logic capacity, on-chip memory and I/O for low-cost embedded and DSP designs. It targets applications that require flexible, reprogrammable logic integration with support for common FPGA architectural features such as embedded memory, multipliers and a global clock network.

Key hardware data for quick evaluation: 18,752 logic elements, approximately 0.24 Mbits of embedded memory, 152 I/O pins, a 256-LBGA supplier package (256-FBGA 17×17), 1.15–1.25 V core supply range and commercial operating temperature from 0 °C to 85 °C.

Key Features

• Logic Capacity  18,752 logic elements providing a sizable fabric for glue logic, finite-state machines and moderate-complexity custom logic implementations.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM suitable for FIFOs, small buffers and local data storage.
• Rich I/O  152 user I/O pins to support multi‑channel interfacing and peripheral connections across I/O banks.
• Clocking and Timing  Cyclone II family architecture includes a global clock network and phase‑locked loop (PLL) support for disciplined clock distribution and frequency management.
• DSP Resources  Embedded multipliers and associated routing resources from the Cyclone II family enable efficient implementation of arithmetic and DSP building blocks.
• Memory Block Architecture  M4K embedded memory blocks (Cyclone II family feature) and flexible memory modes for different buffering and storage needs.
• Package & Mounting  256-LBGA package with supplier device package indicated as 256-FBGA (17×17). Surface-mount mounting type for PCB assembly.
• Power & Thermal  Core voltage supply range of 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant manufacturing.

Typical Applications

• Low-Cost Embedded Processing  Implement microcontroller accelerators, custom peripheral interfaces or hardware-controlled state machines where reprogrammability and moderate logic density are required.
• Digital Signal Processing (DSP)  Use the embedded multipliers and on-chip memory for FIR/IIR filtering, signal conditioning and moderate-throughput DSP tasks.
• High‑Speed Interface Prototyping  Leverage the 152 I/O pins and Cyclone II I/O features to prototype memory interfaces, SERDES-less parallel links and board-level bridges.
• Interface and Glue Logic  Replace multiple discrete logic devices with a single FPGA to consolidate control, timing and protocol translation functions.

Unique Advantages

• Significant Logic Density: 18,752 logic elements provide the capacity to integrate multiple functions and reduce system BOM by consolidating discrete logic.
• On-Chip Memory for Local Storage: Approximately 0.24 Mbits of embedded RAM supports FIFOs, buffering and small data structures without external memory.
• Flexible I/O Count: 152 I/O pins enable multi-peripheral connectivity and board-level interfacing without immediate need for expansion devices.
• Clocking and DSP Support: Cyclone II family features such as PLLs, a global clock network and embedded multipliers simplify timing design and signal processing tasks.
• Commercial Temperature Range: Rated 0 °C to 85 °C for a broad set of general-purpose electronic applications.
• RoHS Compliance: Environmentally compliant manufacturing meets common regulatory requirements for electronic assemblies.

Why Choose EP2C20F256C8N?

The EP2C20F256C8N positions itself as a practical Cyclone II FPGA option for designers needing a mix of logic density, embedded memory and I/O without moving to higher-cost device families. Its combination of 18,752 logic elements, approximately 0.24 Mbits of embedded RAM and 152 I/Os in a 256-ball package makes it suitable for low-cost embedded processing, moderate DSP tasks and board-level interface consolidation.

Backed by Cyclone II family documentation and design resources, the EP2C20F256C8N supports engineers who require a documented, reprogrammable platform for prototyping, system integration and short to mid-run production deployments.

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