EP2C20F256C8

The EP2C20F256C8 is a Cyclone® II family FPGA from Intel (Altera) delivering a mid-range programmable logic resource set in a compact 256‑ball LBGA package. It combines 18,752 logic elements with on‑chip embedded memory and programmable I/O to address low‑cost embedded processing and DSP‑oriented designs.

Designed for surface‑mount assembly and commercial‑grade operation (0 °C to 85 °C) with a core voltage range of 1.15 V to 1.25 V, this device targets applications that require flexible integration of logic, memory, and I/O in a single IC.

Key Features

• Logic Capacity — 18,752 logic elements and 1,172 LABs provide configurable logic resources for mid‑range FPGA designs.
• Embedded Memory — Approximately 0.24 Mbits (239,616 bits) of on‑chip RAM to implement FIFOs, buffers, and distributed storage.
• I/O Resources — 152 user I/O pins with advanced I/O features such as programmable drive strength, open‑drain outputs, slew‑rate control, bus‑hold and programmable pull‑ups (as described in the Cyclone II device handbook).
• DSP and Timing Support — Family‑level support for embedded multipliers and PLLs for common DSP and clocking functions (detailed in the Cyclone II documentation).
• Power and Packaging — Core supply range of 1.15 V to 1.25 V; surface‑mount 256‑LBGA package (supplier package: 256‑FBGA, 17×17 mm) for compact board integration.
• Commercial Grade — Operating temperature range 0 °C to 85 °C; RoHS‑compliant construction.

Typical Applications

• Low‑Cost Embedded Processing — Implement control logic, protocol handling, and soft‑processor functions using the Cyclone II logic and memory resources.
• Digital Signal Processing — Use embedded multipliers and on‑chip RAM for DSP tasks such as filtering, transforms, and data path acceleration.
• Memory Interface and Bridging — Leverage the device’s memory resources and I/O features for external memory interfacing and bus bridging functions.
• High‑Speed I/O Interfaces — Deploy programmable I/O capabilities and differential interface support for high‑speed signaling and peripheral connectivity.

Unique Advantages

• Balanced Logic and Memory — 18,752 logic elements combined with approximately 0.24 Mbits of embedded RAM enable complex logic and modest on‑chip storage without external components.
• Flexible I/O — 152 I/O pins with programmable drive and I/O features simplify board‑level interfacing across voltage domains and signal types.
• Compact, Surface‑Mount Package — 256‑LBGA (17×17 supplier FBGA) offers a small footprint for space‑constrained PCBs.
• Commercial‑Grade Reliability — Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Low Core Voltage — 1.15 V to 1.25 V core supply supports power‑conscious designs while conforming to Cyclone II device requirements.

Why Choose EP2C20F256C8?

The EP2C20F256C8 provides a practical mix of logic density, embedded memory, and versatile I/O in a compact 256‑LBGA package, making it well suited for designers who need mid‑range FPGA capability for low‑cost embedded processing and DSP tasks. Its documented Cyclone II architecture and device handbook support predictable implementation of clocking, memory, and I/O functions.

Choose this device when you require a commercially graded, RoHS‑compliant FPGA with a clear balance of resources and board‑level integration benefits — ideal for projects that demand flexible programmable logic without extensive external components.

Request a quote or submit an inquiry to evaluate EP2C20F256C8 for your next design and get detailed ordering and support information.