EP2C20F484C8N

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

Quantity 334 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C20F484C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

The EP2C20F484C8N is a Cyclone® II series field programmable gate array (FPGA) optimized for low-cost embedded processing and DSP-focused solutions. It provides a balance of logic capacity, on-chip memory, and flexible I/O to address medium-density logic and interface tasks in commercial applications.

With 18,752 logic elements, approximately 0.24 Mbits of embedded memory, and 315 general-purpose I/Os in a 484-ball BGA package, this device targets designs that require substantial programmable logic, plentiful I/O, and configurable clocking and memory resources.

Key Features

  • Core Logic  Provides 18,752 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
  • Embedded Memory  Approximately 0.24 Mbits of on-chip RAM organized for embedded memory use and external-memory interfacing as described in device documentation.
  • I/O Density  315 I/O pins support diverse peripheral and bus connections for system integration and high-density interface requirements.
  • Clocking and PLLs  Includes a global clock network and phase-locked loop (PLL) features for flexible clock distribution and clock management (series-level feature).
  • Advanced I/O Features  Series documentation notes support for programmable drive strength, slew-rate control, bus-hold, programmable pull-ups, and series on-chip termination for robust I/O integration.
  • Embedded DSP Support  Cyclone II family architecture includes embedded multipliers and DSP-oriented features suitable for low-cost DSP solutions (series-level feature).
  • Power and Package  Operates from a core supply of 1.15 V to 1.25 V and is supplied in a 484-FBGA (23×23) surface-mount package (484-BGA case) for compact board-level integration.
  • Commercial Grade & Compliance  Rated for commercial operating temperatures (0 °C to 85 °C) and RoHS compliant for regulatory conformance.

Typical Applications

  • Embedded Processing  Low-cost embedded controllers and system logic that leverage the Cyclone II architecture for control, glue logic, and protocol handling.
  • DSP and Signal Processing  Signal-processing and filtering tasks that use the device’s embedded multipliers and memory resources for efficient datapath implementation.
  • Memory Interface Controllers  External memory interfacing and buffering functions supported by on-chip memory and documented external-memory interfacing guidance.
  • High-Density I/O Bridging  Applications requiring many general-purpose I/Os for peripheral aggregation, bus bridging, or multi-device interconnects benefit from the 315 I/O pins.

Unique Advantages

  • Substantial Logic Capacity: 18,752 logic elements provide ample programmable resources for medium-complexity designs without external ASIC development.
  • Integrated Memory Resources: Approximately 0.24 Mbits of embedded RAM reduces external memory dependence and simplifies board-level BOM.
  • High I/O Count: 315 I/Os enable flexible interfacing to sensors, peripherals, and external devices, minimizing the need for additional I/O expanders.
  • Flexible Clocking: Global clock network and PLL support provide configurable clock distribution for synchronized multi-domain designs.
  • Compact Surface-Mount Package: The 484-FBGA (23×23) package balances pin count and board space for dense system designs.
  • Commercial Temperature & RoHS Compliance: Designed for commercial environments (0 °C to 85 °C) and RoHS compliant for regulatory alignment.

Why Choose EP2C20F484C8N?

The EP2C20F484C8N positions itself as a versatile, mid-range Cyclone II FPGA offering a strong combination of logic capacity, embedded memory, and I/O density in a compact 484-BGA package. It is well suited for commercial embedded systems and DSP-focused designs that require on-chip resources for performance and integration.

Engineers and procurement teams looking for a proven Cyclone II device will find this part delivers scalable logic and I/O for medium-complexity applications, backed by comprehensive device documentation and family-level features for clocking, I/O configuration, and memory interfacing.

Request a quote or submit an inquiry to get pricing and availability for the EP2C20F484C8N for your next design.

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