EP2C20F484I8

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 18752 484-BGA

Quantity 1,248 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1172Number of Logic Elements/Cells18752
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C20F484I8 – Cyclone® II FPGA, 18,752 logic elements, 484-BGA

The EP2C20F484I8 is a Cyclone II field-programmable gate array (FPGA) offered in a 484-BGA package and specified for industrial operation. The device integrates 18,752 logic elements and on-chip embedded memory to support low-cost embedded processing and DSP-oriented designs.

Designed for applications that require a balance of logic capacity, embedded memory, and flexible I/O, this Cyclone II device delivers a compact, industrial-grade FPGA option with a multi-volt I/O architecture and dedicated clock and PLL resources referenced in the Cyclone II device handbook.

Key Features

  • Logic Capacity  18,752 logic elements organized across 1,172 LABs for implementing custom logic, control, and datapath functions.
  • Embedded Memory  Approximately 0.24 Mbits (239,616 bits) of on-chip RAM suitable for buffers, FIFOs, and small embedded storage.
  • I/O Resources  315 user I/O pins with support for the device's I/O structure and advanced I/O standards as documented in the Cyclone II handbook.
  • Clocking and Timing  Global clock network and phase-locked loop (PLL) resources are documented for robust clock distribution and frequency synthesis.
  • Dedicated DSP Support  Embedded multiplier resources and multiplier routing interfaces are available for DSP and arithmetic-intensive functions (see Cyclone II device handbook).
  • Package  484-BGA footprint, supplied as 484-FBGA (23×23), providing a compact surface-mount solution.
  • Power  Core supply range specified at 1.15 V to 1.25 V for core power planning and system rail design.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C for industrial deployment.
  • Configuration & Testing  Supports standard configuration and JTAG boundary-scan functionality as described in the Cyclone II documentation.

Typical Applications

  • Low-Cost Embedded Processing  Platform-level control, glue logic, and custom processing functions where integrated logic and on-chip memory can reduce external component count.
  • DSP and Signal Processing  Fixed-point DSP blocks and embedded multipliers enable implementation of filtering, aggregation, and signal conditioning functions.
  • External Memory Interface  Designed for systems requiring external memory interfacing and programmable I/O timing for memory subsystems (see device handbook).
  • High-Speed I/O and Interface Bridging  Supports high-speed differential interfaces and a range of I/O standards for communication and protocol bridging tasks.

Unique Advantages

  • Balanced Logic and Memory:  18,752 logic elements combined with ~0.24 Mbits of embedded RAM enable complex state machines and local buffering without immediate need for large external RAM.
  • Comprehensive I/O:  315 I/O pins and documented support for advanced I/O standards provide flexibility for interfacing sensors, peripherals, and high-speed links.
  • Industrial Reliability:  Specified −40 °C to 100 °C operating range fits industrial environments where extended temperature performance is required.
  • Compact Packaging:  484-FBGA (23×23) package provides a dense footprint for space-constrained boards while maintaining accessible I/O counts.
  • Power-Managed Core:  Core voltage range of 1.15–1.25 V allows predictable power budgeting for system design.
  • Documented Architecture:  Extensive Cyclone II device handbook coverage (architecture, routing, clocking, memory, and I/O) supports design planning and verification.

Why Choose EP2C20F484I8?

The EP2C20F484I8 Cyclone II FPGA is positioned for designs that need a practical combination of logic resources, embedded memory, and flexible I/O within an industrial-temperature, compact BGA package. It is well-suited to engineers building low-cost embedded processing, DSP, and interface-bridging solutions who require documented architecture and configuration resources.

With a defined core voltage range, comprehensive handbook documentation on clocking and I/O, and industrial-grade temperature specification, the EP2C20F484I8 provides a reliable, scalable building block for mid-range FPGA applications.

Request a quote or submit an inquiry to evaluate EP2C20F484I8 for your next embedded or DSP-oriented design.

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