EP2C20F484I8N

The EP2C20F484I8N is an Intel Cyclone® II FPGA targeted at low-cost embedded processing and DSP-focused designs. It combines a moderate logic density architecture with embedded memory, programmable I/O, and a compact 484-BGA package to address space- and cost-sensitive industrial applications.

With 18,752 logic elements and approximately 0.24 Mbits of on-chip RAM, this device supports flexible logic implementation, memory buffering, and signal-processing blocks while providing industrial temperature range and RoHS compliance for robust deployment.

Key Features

• Core Logic  18,752 logic elements provide scalable fabric for combinational and sequential logic implementations.
• Embedded Memory  Approximately 0.24 Mbits of total on-chip RAM for data storage, FIFOs, and buffering.
• I/O Capacity  315 user I/O pins deliver flexible external interfacing and support for a variety of signaling schemes described in the Cyclone II documentation.
• Programmable I/O & Interfaces  Architecture documentation details advanced I/O structure, high-speed differential interfaces, programmable drive strength, and on-chip termination options for diverse interfacing requirements.
• Clocking & PLLs  The Cyclone II family includes dedicated global clock networks and PLL support for clock management and distribution.
• Power & Supply  Core voltage supply range of 1.15 V to 1.25 V to match platform power domains.
• Package & Mounting  484-BGA (484-FBGA, 23×23) surface-mount package for dense PCB integration.
• Industrial Temperature & Reliability  Rated for operation from −40 °C to 100 °C and listed as Industrial grade; RoHS compliant.
• Configuration & Test Support  Device documentation includes IEEE 1149.1 (JTAG) boundary-scan support and configuration/testing guidance for system integration.
• Device Documentation  Cyclone II device handbook provides detailed architecture, timing, and interfacing information to support design and validation.

Typical Applications

• Embedded Processing  Low-cost embedded processing solutions that need configurable logic and on-chip memory for control and data-path tasks.
• Digital Signal Processing  DSP-oriented implementations leveraging the Cyclone II architecture’s embedded multipliers and memory for filtering, transforms, and fixed-function acceleration.
• Memory Interface Bridging  External memory interfacing and bus-bridging applications taking advantage of the documented external memory interface features.
• Industrial Control  Control, monitoring, and I/O aggregation in industrial systems benefitting from the device’s industrial temperature rating and extensive I/O count.

Unique Advantages

• Moderate Logic Density: 18,752 logic elements enable substantial implementation of custom logic without excessive board-level complexity.
• On-Chip Memory: Approximately 0.24 Mbits of embedded RAM reduces the need for external memory in many control and buffering scenarios.
• High I/O Count: 315 I/Os provide design flexibility for interfacing multiple peripherals or bus standards on a single device.
• Industrial Operating Range: −40 °C to 100 °C rating supports deployment in harsh environments where temperature robustness is required.
• Compact BGA Package: 484-FBGA (23×23) enables dense placement on PCBs for space-constrained systems.
• Standards-Based Test & Configuration: JTAG boundary-scan and Cyclone II handbook guidance simplify board bring-up, configuration, and validation.

Why Choose EP2C20F484I8N?

The EP2C20F484I8N positions itself as a cost-conscious Cyclone II FPGA option for designers who need a balance of logic capacity, embedded memory, and extensive I/O in an industrial-grade package. Its documented architecture—covering programmable I/O, clocking, embedded multipliers, and memory—helps teams map control, signal-processing, and interface functions into a single device.

Supported by the Cyclone II device handbook and Intel/Altera documentation, this part is suited for engineering teams building embedded systems, DSP modules, or industrial controllers that require a documented FPGA architecture, predictable power domain requirements (1.15–1.25 V), and a robust operating temperature range.

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