EP2C35F484C6N

IC FPGA 322 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 322 483840 33216 484-BGA

Quantity 796 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O322Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2076Number of Logic Elements/Cells33216
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits483840

Overview of EP2C35F484C6N – Cyclone® II Field Programmable Gate Array (FPGA) IC 322 483840 33216 484-BGA

The EP2C35F484C6N is a Cyclone II family FPGA offering a medium-density programmable fabric targeted at low-cost embedded processing and DSP applications. It provides 33,216 logic elements organized across 2,076 LABs, approximately 0.484 Mbits of embedded memory, and 322 user I/Os in a 484-ball FBGA (23×23) package.

Designed for commercial-grade systems, the device operates from a 1.15 V to 1.25 V supply and across a 0 °C to 85 °C ambient range. Documentation and device handbook details (Cyclone II architecture, PLLs, embedded multipliers, memory modes, and I/O features) support integration into board- and system-level designs.

Key Features

  • Logic Capacity — 33,216 logic elements arranged in 2,076 LABs for implementing medium-density logic, glue logic, and embedded finite-state machines.
  • Embedded Memory — Approximately 0.484 Mbits of on-chip RAM suitable for FIFOs, small buffers, and control-state storage.
  • I/O and Package — 322 user I/Os in a 484-FBGA (23×23) package supporting multi-bank I/O configurations and system interfacing.
  • Clocking and DSP Blocks — Cyclone II architecture includes a global clock network, phase-locked loops (PLLs), and embedded multipliers for common DSP and timing functions (see device handbook for details).
  • Power Supply — Core supply range of 1.15 V to 1.25 V to match Cyclone II power domains and board-level power design.
  • Commercial Temperature Rating — Specified for 0 °C to 85 °C operation for commercial applications.
  • Surface-Mount Package — 484-ball BGA surface-mount package for compact PCB integration and thermal/power routing on multilayer boards.
  • Standards and Documentation — RoHS-compliant and supported by the Cyclone II device handbook and related Altera documentation for configuration, timing, and I/O guidance.

Typical Applications

  • Embedded Processing — Implements custom control logic and embedded processors for consumer and industrial equipment using the Cyclone II architecture.
  • Low-Cost DSP — Accelerates signal processing functions using embedded multipliers and the device’s clocking resources for audio, communications, and sensor processing tasks.
  • Interface Bridging and Glue Logic — Provides parallel and serial interface adaptation between system components with plentiful I/O and on-chip RAM for buffering.
  • Prototyping and Evaluation — Medium-density logic and documented device features make the part suitable for development platforms and proof-of-concept designs.

Unique Advantages

  • Balanced Logic and Memory — 33,216 logic elements together with approximately 0.484 Mbits of embedded RAM enables combined control and data-path implementations without immediate external memory dependence.
  • High I/O Count in Compact Footprint — 322 user I/Os in a 484-FBGA (23×23) package provide extensive board-level connectivity while conserving PCB area.
  • Integrated Clocking and DSP Support — On-chip PLLs, global clock network, and embedded multipliers simplify timing and DSP design tasks referenced in the Cyclone II handbook.
  • Commercial-Grade Reliability — Specified for 0 °C to 85 °C operation and RoHS-compliant for standard commercial product deployments.
  • Documented Architecture — Comprehensive Cyclone II device handbook coverage of architecture, I/O standards, configuration, and timing helps accelerate development and verification.

Why Choose EP2C35F484C6N?

EP2C35F484C6N positions itself as a practical medium-density Cyclone II FPGA for designers who need a balance of logic resources, embedded memory, and I/O capacity in a compact BGA package. Its documented architecture—including clocking resources, embedded multipliers, and memory modes—helps teams implement embedded control, DSP acceleration, and interface tasks within a commercial temperature envelope.

For projects requiring a documented, RoHS-compliant Cyclone II device with 33,216 logic elements and a high I/O count, EP2C35F484C6N offers a clear specification set and vendor-supplied handbook material to support integration, bring-up, and system-level testing.

Request a quote or submit an inquiry for pricing and availability to begin integrating EP2C35F484C6N into your next design.

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