EP2C35F484C8N

The EP2C35F484C8N is a Cyclone® II family FPGA from Intel, delivered in a 484-ball BGA package for surface-mount board designs. It integrates 2,076 LABs providing 33,216 logic elements, approximately 0.48 Mbits of embedded memory, and 322 user I/Os to support a wide range of commercial embedded and DSP applications.

Designed for low-voltage core operation (1.15 V to 1.25 V) and commercial operating temperatures (0 °C to 85 °C), this device combines configurable logic, on-chip memory, and family-level features such as global clock networks, PLLs, embedded multipliers, and flexible I/O support.

Key Features

• Core & Logic  2,076 LABs delivering 33,216 logic elements for implementing control, protocol, and datapath logic.
• Embedded Memory  Approximately 0.48 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables.
• I/O & Interface Count  322 user I/Os with device-level support for advanced I/O standards and high-speed differential interfaces as defined in the Cyclone II family documentation.
• Clocking & DSP Support  Family-level features include a global clock network, PLLs, and embedded multipliers to support synchronous designs and DSP operations.
• Power & Operation  Low-voltage core supply range of 1.15 V to 1.25 V and a commercial-grade operating range of 0 °C to 85 °C.
• Package & Mounting  484-ball BGA package (supplier package: 484-FBGA, 23 × 23) in a surface-mount form factor suitable for compact, production PCBs.
• Compliance  RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Embedded Processing  Low-cost embedded processing solutions that require configurable logic and on-chip memory for control and glue logic.
• DSP Acceleration  Low-cost DSP solutions leveraging the device’s embedded multipliers and clocking resources for signal processing tasks.
• External Memory Interfacing  Designs requiring external memory control and interface logic, using the device’s memory interface features and abundant I/O.
• High-Speed I/O and Protocol Bridging  Implement protocol conversion, differential signaling, and high-speed I/O functions supported by the Cyclone II family I/O architecture.

Unique Advantages

• High Logic Density: 33,216 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count.
• Meaningful On-Chip RAM: Approximately 0.48 Mbits of embedded memory supports local buffering and state storage without external RAM for many applications.
• Extensive I/O Count: 322 user I/Os provide flexibility to interface with a broad set of peripherals and external devices.
• Low-Voltage Core: 1.15 V–1.25 V core supply supports low-voltage system architectures and power-conscious designs.
• Family-Level Feature Set: Cyclone II documentation describes global clock networks, PLLs, embedded multipliers, and advanced I/O support, enabling robust timing and DSP implementations.
• Compact BGA Package: 484-ball BGA (484-FBGA, 23 × 23) in a surface-mount footprint for space-constrained board designs.

Why Choose EP2C35F484C8N?

The EP2C35F484C8N positions itself as a balanced, commercial-grade FPGA option within the Cyclone II family that combines substantial logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its low-voltage core and family-level clocking and DSP features make it suitable for embedded processing and signal-processing applications that require configurable logic and reliable interfacing.

Backed by Cyclone II device documentation from Intel, the EP2C35F484C8N is appropriate for design teams seeking a documented, field-programmable solution for commercial applications where integration, predictable operating conditions (0 °C to 85 °C), and RoHS compliance matter.

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