EP2C35F484C7N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 322 483840 33216 484-BGA |
|---|---|
| Quantity | 1,423 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 322 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2076 | Number of Logic Elements/Cells | 33216 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 483840 |
Overview of EP2C35F484C7N – Cyclone® II Field Programmable Gate Array (FPGA) IC 322 483840 33216 484-BGA
The EP2C35F484C7N is a Cyclone® II FPGA in a 484-BGA package designed for commercial embedded and logic-intensive applications. It implements the Cyclone II architecture, offering a balance of programmable logic, embedded memory, and I/O capacity for cost-sensitive system designs.
With 33,216 logic elements, approximately 0.48 Mbits of embedded memory and 322 I/Os, this device targets applications that require moderate logic density, flexible I/O, and established Cyclone II architecture features such as global clock networks, PLL support and embedded DSP resources.
Key Features
- Logic Capacity — 33,216 logic elements provide substantial programmable resources for combinational and sequential logic implementation.
- Embedded Memory — Approximately 0.48 Mbits of on-chip RAM suitable for buffers, FIFOs and small on-chip data stores.
- I/O — 322 general-purpose I/O pins to support multiple interfaces and peripheral connections in a single device.
- Power Supply — Core operating voltage range of 1.15 V to 1.25 V to match Cyclone II power domains.
- Package & Mounting — 484-BGA package; supplier device package listed as 484-FBGA (23x23). Surface-mount mounting type simplifies PCB assembly for compact systems.
- Operating Conditions — Commercial-grade device rated for 0 °C to 85 °C operation.
- Cyclone II Architecture Features — Datasheet sections describe global clock networks, phase-locked loops (PLLs), embedded multipliers, on-chip memory blocks and flexible I/O structures for clocking, DSP and memory interfacing.
- Standards & Compliance — RoHS compliant, supporting current environmental compliance requirements.
Typical Applications
- Embedded Processing & Prototyping — Implement control logic, glue logic, and prototype digital systems that require a moderate number of logic elements and on-chip memory.
- DSP and Signal Processing — Use embedded multipliers and on-chip memory for moderate-throughput DSP tasks and data-path acceleration.
- Interface Bridging — Leverage 322 I/Os to bridge between multiple peripherals, sensors, and external memory or bus interfaces.
- Low-to-Medium Density Custom Logic — Ideal for designs that need configurable logic, clock management and moderate embedded memory in a compact BGA footprint.
Unique Advantages
- Substantial Logic Resource: 33,216 logic elements provide designers with flexibility to implement complex state machines, custom controllers and glue logic without multiple ICs.
- On-Chip Memory for Local Data Storage: Approximately 0.48 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
- High I/O Count: 322 I/Os enable wide parallel interfaces and multiple peripheral connections from a single FPGA device.
- Proven Cyclone II Architecture: Architecture features such as PLLs, global clock networks and embedded multipliers support common clocking and DSP needs documented in the Cyclone II handbook.
- Compact BGA Packaging: 484-BGA (supplier: 484-FBGA (23x23)) allows high-density board layouts while maintaining surface-mount assembly compatibility.
- Commercial Temperature Range & RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial product requirements.
Why Choose EP2C35F484C7N?
The EP2C35F484C7N combines a robust Cyclone II architecture with mid-range logic density, embedded memory, and a high pin count in a compact 484-BGA package. It is well suited for engineers and designers who need a commercially graded FPGA for embedded processing, interface bridging, and moderate DSP acceleration in cost-sensitive designs.
With documented architecture features such as global clock networks, PLL support, embedded multipliers and on-chip memory, the EP2C35F484C7N offers a reliable and scalable platform for designs that leverage Cyclone II capabilities and established design flows.
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