EP2C35F484I8N

The EP2C35F484I8N is a Cyclone® II FPGA optimized for cost-sensitive embedded processing and DSP-oriented designs. It combines a programmable logic fabric with on-chip memory, dedicated multiplier resources, and a flexible I/O set to support a wide range of low-cost processing and interfacing tasks.

Key platform attributes include 33,216 logic elements, approximately 0.484 Mbits of embedded memory, 322 general-purpose I/Os, an industrial operating temperature range, and a 484-ball BGA package—providing a balance of integration and ruggedness for industrial applications.

Key Features

• Logic Capacity — 33,216 logic elements supporting complex programmable logic implementations and moderate-density designs.
• Embedded Memory — Approximately 0.484 Mbits (483,840 bits) of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Density — 322 I/O pins to support broad peripheral interfacing, parallel buses, and multi-channel connectivity.
• Clocking and DSP Support — Device handbook references include PLLs, a global clock network, and embedded multipliers to support timing management and arithmetic-accelerated functions.
• Power Supply — Core operating range of 1.15 V to 1.25 V to match system power-rail requirements.
• Package and Mounting — 484-BGA (supplier device package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Standards & Documentation — Supported by the Cyclone II Device Handbook and related Altera/Intel documentation covering architecture, I/O standards, configuration, and timing.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Low-cost embedded processing — Implement microcontroller offload, protocol handling, and custom control logic using the programmable fabric and on-chip memory.
• Digital signal processing (DSP) — Leverage embedded multipliers and the clocking architecture for filtering, transform, and real-time signal tasks.
• External memory interfacing — Use the device’s I/O resources and documented external memory interfacing capabilities for memory controller or buffer designs.
• High-speed I/O and interface bridging — Deploy the 322 I/Os and the device’s I/O structure for multi-channel communication, parallel buses, and differential interfaces described in the device handbook.

Unique Advantages

• High logic density: 33,216 logic elements provide the capacity to implement sizable custom logic and state machines without external ASICs.
• Substantial on-chip memory: Approximately 0.484 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O count: 322 I/Os simplify integration with peripherals, sensors, and external buses, reducing board-level complexity.
• Industrial-grade temperature range: −40 °C to 100 °C operation supports deployment in demanding environments.
• Flexible clocking and DSP building blocks: Documented PLLs, global clock networks, and embedded multipliers enable robust timing architectures and arithmetic acceleration.
• Compact BGA package: 484-FBGA (23 × 23) surface-mount package enables high-density board layouts while maintaining signal integrity.

Why Choose EP2C35F484I8N?

The EP2C35F484I8N positions itself as a practical Cyclone II FPGA choice for engineers needing a balanced combination of logic capacity, on-chip memory, and I/O resources in an industrial-grade package. Its documented architecture—covering clocking, memory modes, and I/O features—makes it suitable for designs focused on embedded processing, DSP acceleration, and complex interfacing tasks.

For projects where predictable temperature performance, RoHS compliance, and a compact 484-BGA footprint matter, the EP2C35F484I8N offers a clear, verifiable specification set and supporting handbook-level documentation to aid development and system integration.

If you would like pricing or availability information, request a quote or submit a purchase inquiry today to receive a formal quotation and lead-time details.