EP2C35F672C7N

The EP2C35F672C7N is a Cyclone® II field programmable gate array (FPGA) device from Intel. It provides a mid-range FPGA fabric with 33,216 logic elements and embedded resources targeted at low-cost embedded processing and DSP-oriented designs.

Its combination of on-chip memory, embedded multipliers, programmable clocking resources and a high I/O count makes it suitable for applications requiring flexible logic integration, significant I/O connectivity and moderate on-chip memory capacity.

Key Features

• Programmable Logic — 33,216 logic elements for implementing custom digital logic, state machines, and glue logic.
• Embedded Memory — Approximately 0.48 Mbits of on-chip RAM (483,840 total RAM bits) for FIFOs, buffers and small data stores.
• DSP & Arithmetic — Device family documentation describes embedded multipliers and multiplier routing for DSP operations and arithmetic acceleration.
• Clocking & PLLs — Integrated global clock network and phase-locked loops (PLLs) support flexible clock distribution and frequency synthesis.
• High I/O Count — 475 user I/O pins to support wide parallel interfaces, bus bridging and multi‑device connectivity.
• Power — Core supply range 1.15 V to 1.25 V to match documented Cyclone II operating conditions.
• Package & Mounting — 672-ball fine-pitch BGA package (672‑FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Compliance — RoHS compliant.

Typical Applications

• Low‑Cost Embedded Processing — Implement compact embedded controllers, peripheral managers or custom processing pipelines using the device’s logic and memory resources.
• DSP and Signal Processing — Use embedded multipliers and on-chip RAM to accelerate fixed-point DSP functions and streaming data processing.
• High‑Density I/O Control — 475 I/O pins enable wide parallel interfaces, protocol bridging and multi‑sensor or multi‑port designs.
• Prototyping and Custom Logic — Flexible FPGA fabric and comprehensive device documentation make the part suitable for hardware prototyping and custom IP integration.

Unique Advantages

• High logic density: 33,216 logic elements allow substantial functionality on a single device, reducing board-level component count.
• On-chip memory for buffering: Approximately 0.48 Mbits of embedded RAM supports local data storage for streaming and packetized data paths.
• Extensive I/O capability: 475 user I/O pins provide flexibility for parallel interfaces, external memory control and multi‑peripheral connectivity.
• Integrated clocking resources: Global clock network and PLLs enable precise clock management across implemented logic and DSP blocks.
• Compact, surface-mount package: 672‑FBGA (27×27) delivers high pin count in a compact footprint for dense PCB designs.
• Commercial-grade and RoHS compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and compliant with RoHS requirements.

Why Choose EP2C35F672C7N?

The EP2C35F672C7N delivers a balanced mix of programmable logic density, embedded memory and I/O capacity suitable for low-cost embedded processing and DSP-focused designs. Its Cyclone II architecture includes embedded multipliers, configurable PLLs and a global clock network documented in the Cyclone II Device Handbook, enabling designers to implement a broad range of custom hardware functions on a single FPGA.

This device is well suited for development teams and procurement organizations seeking a commercially rated FPGA with substantial I/O and logic resources in a compact BGA package, backed by established device documentation and platform support.

Request a quote or submit an inquiry for the EP2C35F672C7N to review availability and pricing for your next design.