EP2C35F672C8N

The EP2C35F672C8N is a Cyclone® II field-programmable gate array (FPGA) in a 672‑FBGA package. It implements the Cyclone II architecture with a substantial logic fabric and embedded on-chip memory, targeting low-cost embedded processing and DSP-oriented applications.

With 475 I/O pins, support for programmable I/O features, integrated multipliers and PLLs, and a compact surface-mount 27×27 672‑FBGA package, this device is intended for designers needing dense I/O, flexible clocking and embedded memory in commercial-temperature systems.

Key Features

• Logic Fabric — 33,216 logic elements and 2,076 logic array blocks provide the programmable logic resources for custom control, interface and compute functions.
• Embedded Memory — Approximately 0.48 Mbits (483,840 bits) of on-chip RAM implemented with M4K memory blocks for packet buffering, FIFO storage and small on-chip data structures.
• DSP and Clocking — Integrated embedded multipliers and phase-locked loops (PLLs) enable basic DSP operations and flexible clock management for synchronous designs.
• I/O Capacity & Flexibility — 475 user I/O pins with support for advanced I/O standards, differential interfaces, programmable drive strength, slew-rate control and on-chip series termination for robust external interfacing.
• Package & Mounting — Supplied in a 672‑FBGA (27×27) surface-mount package for high-density board layouts and reliable soldered mounting.
• Power & Environmental — Core supply range 1.15 V to 1.25 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Configuration & Test Support — Includes IEEE 1149.1 (JTAG) boundary-scan support and multiple configuration schemes for device programming and board-level testability.

Typical Applications

• Embedded Processing — Implement microcontroller-like peripherals, custom state machines and control logic for low-cost embedded systems.
• DSP Functions — Use the device’s embedded multipliers and on-chip memory for basic digital signal processing tasks, filtering and data path acceleration.
• High-Density I/O Systems — Interfaces requiring many parallel signals or differential pairs benefit from the 475 I/O pins and programmable I/O features.
• External Memory Interfaces — Support for external memory interfacing makes this FPGA suitable for designs that combine on-chip resources with off-chip RAM or flash.

Unique Advantages

• High logic capacity: 33,216 logic elements and 2,076 logic array blocks give designers room to implement complex control and processing functions on a single device.
• Significant on-chip RAM: Approximately 0.48 Mbits of embedded memory reduces dependence on external memory for small to moderate data buffering and state storage.
• Extensive I/O resources: 475 I/O pins with advanced I/O features simplify board-level connectivity and support a wide range of interface standards.
• Flexible clocking and DSP support: Integrated PLLs and embedded multipliers enable practical clock management and arithmetic acceleration within the FPGA fabric.
• Compact, surface-mount package: The 672‑FBGA (27×27) package allows dense PCBs while maintaining robust soldered connections for production assemblies.
• Commercial-grade operation and compliance: Designed for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications and manufacturing.

Why Choose EP2C35F672C8N?

The EP2C35F672C8N blends substantial programmable logic, embedded memory and DSP-oriented resources with a high I/O count in a compact 672‑FBGA package. It is positioned for commercial designs that require flexible interfacing, on-chip buffering and configurable signal processing within a Cyclone II architecture.

This device is well suited to engineers developing embedded processing platforms, DSP-accelerated subsystems and I/O-intensive controllers who value a balance of integration, configurability and board-level density backed by the Cyclone II device family documentation and feature set.

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