EP2C35F672I8

IC FPGA 475 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 475 483840 33216 672-BGA

Quantity 1,310 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BGANumber of I/O475Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2076Number of Logic Elements/Cells33216
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits483840

Overview of EP2C35F672I8 – Cyclone® II Field Programmable Gate Array (FPGA) IC, 475 I/Os, ~483,840 bits RAM, 33,216 logic elements, 672-BGA

The EP2C35F672I8 is a Cyclone® II family FPGA from Intel, offering a mid-range programmable fabric designed for low-cost embedded processing and DSP-oriented applications. The device combines 33,216 logic elements, approximately 483,840 bits of embedded memory, and a high I/O count to address designs that require integration, flexibility, and industrial-grade operation.

With a 672-ball BGA package and support for industry-standard I/O features and clocking resources, this device targets applications that need significant logic capacity, dense I/O, and operation across an extended temperature range in surface-mount form factors.

Key Features

  • Core Logic 33,216 logic elements provide the programmable logic capacity for implementing custom controllers, datapaths, and state machines.
  • Logic Array Blocks 2,076 logic array blocks (LABs) as part of the Cyclone II architecture to organize and scale logic resources.
  • Embedded Memory Approximately 483,840 bits of on-chip RAM (embedded memory) suitable for FIFOs, buffers, and local storage.
  • High I/O Density 475 available I/O pins accommodate wide parallel interfaces, multi‑bank signaling, and extensive peripheral connectivity.
  • Clocking & PLLs Cyclone II architecture includes a global clock network and phase-locked loop (PLL) support for flexible clock distribution and domain management.
  • Advanced I/O Features Architecture-level support for programmable drive strength, series on‑chip termination, slew-rate control, and multiple I/O standards to ease interface design.
  • Package & Mounting 672-FBGA (27 × 27 mm) surface-mount package for compact board-level integration.
  • Power & Voltage Core supply range specified from 1.15 V to 1.25 V to meet the device’s operating requirements.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for extended-temperature deployments.
  • Compliance RoHS compliant for regulated environmental requirements.

Typical Applications

  • Embedded Processing — Implement application-specific controllers, protocol handling, and hardware-accelerated logic using the device’s 33,216 logic elements and embedded memory.
  • DSP & Signal Processing — Use Cyclone II family DSP resources and embedded multipliers (family-level feature) to build low-cost signal-processing blocks and filters.
  • High-Density I/O Systems — Leverage 475 I/Os and advanced I/O features for multi-channel data acquisition, parallel peripherals, or multi-protocol gateway designs.
  • Memory Interface & Buffering — Utilize on-chip RAM and dedicated I/O features for external-memory interfacing, buffering, and packet-handling in communication endpoints.

Unique Advantages

  • Highly integrated logic and memory: 33,216 logic elements combined with approximately 483,840 bits of embedded memory reduce the need for external components and simplify BOM.
  • Large I/O capacity: 475 I/Os enable complex, parallel interfaces and flexible banked signaling for mixed-voltage designs.
  • Industrial temperature range: −40 °C to 100 °C rating supports deployment in extended-temperature environments.
  • Compact BGA packaging: 672-FBGA (27 × 27 mm) package provides a high-density footprint for space-constrained PCBs.
  • Flexible clocking and timing: Family-level global clock network and PLL support make it easier to manage multiple clock domains and timing-critical functions.
  • Regulatory readiness: RoHS compliance helps streamline environmental compliance requirements.

Why Choose EP2C35F672I8?

The EP2C35F672I8 delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O density within the Cyclone II family. Its industrial-grade temperature range, compact 672-FBGA package, and core supply range make it suitable for applications requiring robust, configurable hardware in surface-mount form factors.

This device is well suited to engineering teams building low-cost embedded processing, DSP-focused designs, or I/O-intensive systems who need a stable, scalable FPGA building block backed by Intel’s Cyclone II device documentation and architecture features.

Request a quote or contact sales to discuss availability, pricing, and how EP2C35F672I8 can fit into your next design.

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