EP2C35F672I8N

The EP2C35F672I8N is an Intel Cyclone® II family FPGA in a 672-ball BGA package, optimized for low-cost embedded processing and DSP-oriented designs. It provides a balance of logic capacity, on-chip memory, and a high I/O count suitable for I/O‑dense, industrial applications that require programmable logic and flexible interfacing.

As a Cyclone II device, this part leverages the family architecture documented in the Cyclone II Device Handbook, including dedicated clocking resources, embedded memory blocks, and DSP features to implement custom logic, memory buffering and high‑throughput data paths.

Key Features

• Logic Capacity  Offers 33,216 logic elements to implement complex programmable logic and state machines.
• Embedded Memory  Approximately 0.484 Mbits of embedded memory (483,840 total RAM bits) for data buffering, FIFOs and on‑chip storage.
• I/O Resources  High pin count with 475 I/O pins to support extensive peripheral, bus and memory interfacing.
• Clocking and DSP Support  Cyclone II architecture includes a global clock network and PLLs, and family documentation covers embedded multipliers and DSP routing for signal processing tasks.
• Power Supply  Operates from a core voltage range of 1.15 V to 1.25 V, enabling integration with modern power architectures.
• Package and Mounting  672‑FBGA (27 × 27) package in a surface‑mount form factor for compact board integration.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Standards and Compliance  RoHS compliant material status for regulatory and manufacturing requirements.

Typical Applications

• Embedded Processing  Custom controllers and soft‑processor implementations that benefit from on‑chip memory and programmable logic.
• Digital Signal Processing  DSP functions and streaming data paths leveraging the Cyclone II family’s embedded multipliers and dedicated clocking resources.
• High‑I/O System Control  I/O‑heavy applications such as industrial control, sensor aggregation and protocol bridging using the device’s 475 I/Os.
• External Memory Interfaces  Designs that require external memory controllers and high‑speed interfacing, supported by family documentation on external memory interfacing.

Unique Advantages

• High Logic Density:  33,216 logic elements provide the capacity to implement complex logic and multiple subsystem functions on a single device, reducing board count.
• Substantial On‑Chip Memory:  Approximately 0.484 Mbits of embedded RAM supports local buffering and deterministic data handling without immediate dependence on external memory.
• Extensive I/O:  475 I/O pins enable broad peripheral connectivity and flexible bus topologies for system integration.
• Industrial Reliability:  Rated operation from −40 °C to 100 °C aligns with industrial deployment requirements for temperature tolerance.
• Compact, Surface‑Mount Packaging:  672‑FBGA (27 × 27) delivers a compact footprint for space‑constrained PCB designs while accommodating high pin counts.
• Documented Architecture:  Supported by the Cyclone II Device Handbook, which details clocking, memory, I/O and configuration features to accelerate design integration.

Why Choose EP2C35F672I8N?

The EP2C35F672I8N positions itself as a practical Cyclone II FPGA for engineers needing a combination of moderate logic density, meaningful on‑chip memory and a large I/O complement in an industrial temperature package. Its documented family architecture provides the building blocks—clock networks, PLLs, embedded memory and multiplier resources—to implement embedded processing, DSP, and complex interface logic.

This device is suited to designs that require a reliable, programmable solution with clear device documentation for integration and long‑term product support. Its industrial temperature rating and RoHS compliance make it appropriate for production systems where thermal range and regulatory compliance matter.

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