EP2C35U484C7

The EP2C35U484C7 is an Intel Cyclone® II field programmable gate array (FPGA) supplied in a 484-ball FBGA package. It delivers a mid-range logic density and a broad I/O count suitable for a variety of commercial embedded processing and DSP-focused designs.

With 33,216 logic elements, approximately 0.48 Mbits of embedded memory and 322 user I/Os, this surface-mount FPGA targets applications that require substantial on-chip logic, flexible I/O, and documented device architecture and system-level features provided in the Cyclone II Device Handbook.

Key Features

• Logic Density  Provides 33,216 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 0.48 Mbits of on-chip RAM to support data buffering, FIFOs and small memory structures within the FPGA fabric.
• I/O Capacity  322 user I/Os to accommodate wide parallel interfaces, multiple peripherals, and mixed-signal I/O clustering.
• Package & Mounting  484-FBGA package, supplier package 484-UBGA (19×19), designed for surface-mount PCB assembly to save board area.
• Power  Core voltage operating range of 1.15 V to 1.25 V for the FPGA core supply.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Standards & Compliance  RoHS-compliant for regulatory and manufacturing requirements.
• Documented Architecture  Cyclone II Device Handbook documents family-level features such as logic elements, embedded multipliers, PLLs, global clock networks, memory modes and I/O structure to assist system design and integration.

Typical Applications

• Embedded Processing  Implements custom controllers, protocol bridges and peripheral glue logic using on-chip logic and embedded memory.
• DSP and Signal Processing  Supports low-cost DSP-focused designs that leverage the family architecture documented for embedded multipliers and memory modes.
• High-Throughput Interfaces  Suitable for designs requiring substantial I/O — parallel buses, sensor arrays or interface aggregation using the 322 available I/Os.
• Memory and Interface Bridging  Used for external memory interfacing and protocol translation tasks referenced in the Cyclone II handbook.

Unique Advantages

• Mid-range integration density: 33,216 logic elements enable substantial on-chip logic integration without moving to larger device classes, reducing external component count.
• Ample I/O: 322 I/Os provide flexibility for parallel peripherals, multi-channel sensor inputs, and mixed interface designs.
• Compact BGA package: 484-FBGA (484-UBGA 19×19) minimizes PCB footprint while supporting high I/O count in a surface-mount form factor.
• Documented architectural support: The Cyclone II Device Handbook provides detailed guidance on clocking, memory modes, I/O structure and configuration to accelerate design and verification.
• Commercial temperature and RoHS compliance: Commercial-grade rating (0 °C to 85 °C) combined with RoHS compliance simplifies qualification for commercial product lines.
• Low-voltage core operation: 1.15 V to 1.25 V core supply supports modern board power architectures and helps manage overall system power.

Why Choose EP2C35U484C7?

The EP2C35U484C7 positions itself as a practical choice for commercial embedded systems and DSP-enabled applications that need a balance of logic capacity, embedded memory and a high I/O count in a compact FBGA package. Its specifications make it suitable for designs where on-chip resources reduce external components and simplify board-level design.

Backed by the Cyclone II Device Handbook documentation, the device offers clear architectural and implementation guidance for clocking, memory and I/O — helping engineering teams bring complex FPGA-based functions to production with predictable design references.

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