EP2C35U484C8

The EP2C35U484C8 is an Intel Cyclone II family field-programmable gate array (FPGA) supplied in a 484-ball FBGA (484-UBGA, 19×19) package. It delivers a balanced combination of logic capacity, embedded memory, and a high I/O count for low-cost embedded processing and DSP-focused implementations.

Key on-device characteristics include 33,216 logic elements, approximately 0.484 Mbits of on-chip RAM (483,840 bits), 322 user I/O pins, and a nominal core supply range of 1.15 V to 1.25 V. The device is specified for commercial operation from 0 °C to 85 °C.

Key Features

• Core Logic  33,216 logic elements provide the programmable fabric for custom digital logic implementation and system integration.
• Embedded Memory  Approximately 0.484 Mbits (483,840 bits) of on-chip RAM for data buffering, FIFOs, and state storage.
• I/O Density  322 user I/O pins support a variety of external interfaces and parallel connectivity requirements.
• Package & Mounting  484-FBGA (484-UBGA, 19×19) ball-grid package optimized for surface-mount assembly and compact board layouts.
• Power  Core voltage supply specified between 1.15 V and 1.25 V to match system power-rail designs.
• Operating Range  Commercial-grade specification with operating temperature from 0 °C to 85 °C suitable for standard commercial environments.
• Configuration & Test Support  Cyclone II architecture documentation includes configuration, JTAG boundary-scan, and device testing information as part of the device handbook.
• Architecture-Level Capabilities  The Cyclone II family documentation describes integrated features such as global clock networks, phase-locked loops (PLLs), embedded multipliers, and M4K memory blocks that are part of the device family architecture.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Low-Cost Embedded Processing  Implement control logic, glue logic, and custom peripherals using the device’s logic elements and on-chip RAM for compact embedded systems.
• DSP Acceleration  Use the Cyclone II family’s DSP-oriented architecture elements—such as embedded multipliers and PLLs described in the device handbook—for low-cost DSP tasks and signal processing pipelines.
• High-Density I/O Control  Leverage 322 user I/O pins for parallel sensor interfaces, display control, or complex board-level interconnect tasks.
• Memory and Buffering  On-chip RAM supports buffering, FIFOs, and temporary data storage for streaming or burst transfer applications.

Unique Advantages

• High Logic Capacity: 33,216 logic elements enable substantial custom logic integration without external CPLDs or additional FPGAs.
• Significant On-Chip Memory: Approximately 0.484 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
• Extensive I/O: 322 I/O pins provide flexibility to connect multiple peripherals, buses, and external devices directly to the FPGA.
• Compact Package: The 484-FBGA (19×19) package delivers a high pin-count footprint in a compact, surface-mount form factor for space-constrained boards.
• Clear Architectural Documentation: Supported by the Cyclone II device handbook with detailed sections on configuration, clocking, memory, and I/O, aiding design and verification.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose EP2C35U484C8?

The EP2C35U484C8 positions itself as a versatile Cyclone II FPGA option for designers seeking a balance of logic density, embedded memory, and high I/O in a compact 484-FBGA package. Its on-chip resources and documented Cyclone II architecture make it suitable for low-cost embedded processing, DSP tasks, and board-level control functions where commercial-grade performance is required.

Backed by comprehensive device handbook documentation, the part is appropriate for engineering teams that require clear architectural guidance and configuration information while integrating FPGA-based functionality into their designs.

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