EP2C35U484C7N

The EP2C35U484C7N is a Cyclone® II Field Programmable Gate Array (FPGA) in a 484‑FBGA (484‑UBGA 19×19) surface‑mount package. It provides a balance of logic density, on‑chip memory, and a large I/O count for low‑cost embedded processing and DSP‑oriented designs.

Engineered for applications that require flexible programmable logic, the device targets low‑cost embedded processing and low‑cost DSP solutions while offering on‑chip resources and I/O capacity suitable for mid‑range system integration.

Key Features

• Logic Capacity  33,216 logic elements (LEs) provide substantial programmable logic for custom digital functions and control logic integration.
• Embedded Memory  Approximately 0.484 Mbits of on‑chip RAM (483,840 total bits) for buffering, small FIFOs, and embedded data storage.
• I/O Density & Package  322 user I/Os in a 484‑FBGA package (supplier package 484‑UBGA, 19×19) with surface‑mount mounting for compact board layouts.
• Core Voltage Range  Core supply voltage from 1.15 V to 1.25 V to match system power rails and FPGA core requirements.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Configuration & Test Support  IEEE Std. 1149.1 JTAG boundary‑scan support and configuration features documented in the Cyclone II device handbook.
• On‑Chip DSP & Clock Resources  Device family documentation includes embedded multipliers and PLL support for clock management and DSP functions.
• I/O and Interface Capabilities  Cyclone II I/O structure includes advanced I/O standard support and external memory interfacing features as described in the device handbook.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Embedded Processing  Custom control, state machines, and offload processors that benefit from integrated programmable logic and on‑chip RAM.
• DSP Acceleration  Signal processing tasks that leverage embedded multipliers and the Cyclone II DSP capabilities for low‑cost DSP solutions.
• High‑Density I/O Systems  Systems requiring numerous user I/Os—such as interface aggregation, protocol bridging, and board‑level glue logic.
• External Memory Interfaces  Designs that need external memory controllers or custom memory interfaces documented in the Cyclone II handbook.

Unique Advantages

• High logic capacity: 33,216 LEs enable substantial custom logic integration and consolidation of discrete functions into a single device.
• Significant I/O resources: 322 user I/Os support complex system interconnects and multiple external interfaces without multiple devices.
• Compact, board‑friendly package: 484‑FBGA (484‑UBGA 19×19) surface‑mount packaging delivers density while supporting compact PCB layouts.
• Embedded memory for local buffering: Approximately 0.484 Mbits of on‑chip RAM reduces external memory requirements for many control and buffering tasks.
• Design and test support: JTAG boundary‑scan and Cyclone II family documentation simplify board bring‑up, configuration, and validation.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose EP2C35U484C7N?

The EP2C35U484C7N places a substantial logic resource set, embedded memory, and a high I/O count into a compact 484‑FBGA package, making it well suited for low‑cost embedded processing and DSP‑oriented designs that require moderate on‑chip resources and extensive board I/O. Its commercial temperature rating, documented configuration and interface features, and RoHS compliance make it a practical choice for standard commercial applications.

Designers seeking a Cyclone II solution with clear device handbook guidance and support for on‑chip multipliers, PLLs, and advanced I/O structures will find this device appropriate for consolidating functions, reducing BOM count, and implementing customized interfaces.

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