EP2C35U484I8N

The EP2C35U484I8N is a Cyclone® II field-programmable gate array (FPGA) in a 484‑FBGA package designed for industrial applications. It provides a mid-density programmable fabric with 33,216 logic elements, approximately 0.46 Mbits of embedded memory, and 322 general-purpose I/O pins for compact, flexible system integration.

Designed for cost-sensitive embedded processing and DSP-oriented implementations, the device combines on-chip memory, embedded multipliers and clocking resources described in the Cyclone II device handbook with an industrial operating temperature range and a narrow-core voltage supply for controlled power designs.

Key Features

• Logic Capacity 32K+ logic elements (33,216 logic elements) to implement combinational and sequential logic, state machines, and glue logic in a single device.
• Embedded Memory Approximately 0.46 Mbits of on-chip RAM (483,840 total RAM bits) for data buffering, FIFOs, and small lookup tables without external memory.
• I/O Density 322 I/O pins to support parallel interfaces, GPIO expansion, and multiple I/O standards as outlined in the Cyclone II I/O architecture.
• Clocking and DSP Resources On-chip support for PLLs, a global clock network, and embedded multipliers as documented in the Cyclone II handbook to simplify clock management and basic DSP functions.
• Package & Mounting 484‑FBGA (484‑UBGA, 19×19) surface-mount package for high‑density board layouts and reliable soldered connections.
• Power Core supply range of 1.15 V to 1.25 V for the FPGA core, enabling targeted power budgeting in system designs.
• Industrial Grade & Temperature Range Rated for industrial operation with an operating temperature range of −40 °C to 100 °C and RoHS compliance for regulatory alignment.
• Configuration & Test Device handbook documentation includes configuration options and JTAG/boundary-scan support for programming and in-system testability.

Typical Applications

• Embedded Processing Use as a low-cost, reprogrammable processing and control element in industrial controllers, protocol bridges, and embedded compute modules.
• DSP and Signal Conditioning Leverage embedded multipliers and on-chip RAM for filtering, accumulation, and moderate-throughput DSP tasks in instrumentation and communications front ends.
• I/O Concentration and Interface Bridging High I/O count supports protocol conversion, parallel bus interfaces, and custom peripheral aggregation on compact PCBs.
• Industrial Automation Industrial-rated temperature range and robust I/O enable sensor interfacing, motor-control logic, and factory-automation sequencing functions.

Unique Advantages

• Balanced Logic and Memory Offers a combined resource set of 33,216 logic elements and roughly 0.46 Mbits of embedded RAM to implement both control logic and local buffering without external memory.
• Flexible I/O Count 322 I/Os provide designers the headroom to consolidate multiple interfaces or offload peripheral functions to the FPGA fabric, reducing board-level complexity.
• Integrated Clocking and DSP Support On-chip PLLs, a structured global clock network, and embedded multipliers simplify clock distribution and basic DSP implementation within the device.
• Industrial Operating Range Specified −40 °C to 100 °C operation and RoHS compliance make the device suitable for a wide range of industrial environments while meeting environmental directives.
• Compact, Standard Package 484‑FBGA (19×19) package enables high-density board designs with a commonly used BGA footprint for automated assembly.
• Tightly Controlled Core Voltage 1.15 V to 1.25 V core supply window supports predictable power design and integration with regulated power rails.

Why Choose EP2C35U484I8N?

The EP2C35U484I8N positions itself as a practical mid-density Cyclone II FPGA that balances logic capacity, embedded memory, and I/O resources in a single industrial-grade package. It is well suited for engineers who need reprogrammable control, moderate DSP capability, and dense I/O in space-constrained boards.

Backed by the Cyclone II device handbook and datasheet documentation, the device provides clear guidance on architecture, configuration, timing, and I/O options—helping teams accelerate design iteration and maintainability over product life cycles.

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