EP2C50F484C7N

The EP2C50F484C7N is a Cyclone® II field programmable gate array (FPGA) from Intel (Altera), delivered in a 484-ball fine-pitch BGA (23 × 23 mm) surface-mount package. It provides a mid-range logic capacity with on-chip memory and extensive I/O for low-cost embedded processing and DSP-oriented designs.

With 50,528 logic elements, approximately 0.59 Mbits of embedded memory and 294 user I/Os, this device targets designs that require a balance of integration, I/O density and power-efficient core voltage operation (1.15–1.25 V) in commercial-temperature environments.

Key Features

• Logic Capacity  50,528 logic elements offering substantial programmable logic resources for mid-density designs.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, FIFOs and small embedded data storage needs.
• I/O Density  294 I/O pins to support complex interfacing, parallel buses and multiple external peripherals.
• Package & Mounting  484-ball fine-pitch BGA (484-FBGA, 23 × 23 mm) for compact, surface-mount board implementations.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match standard Cyclone II power architectures.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Standards & Compliance  RoHS compliant for environmental conformity.
• Documentation  Supported by the Cyclone II Device Handbook and related device documentation for architecture, configuration and timing guidance.

Typical Applications

• Low‑cost Embedded Processing  Implement custom embedded control and glue-logic functions where a balance of logic capacity and I/O is required.
• DSP Acceleration  Use the device for cost-sensitive DSP tasks and signal processing building blocks described in Cyclone II device documentation.
• External Memory Interfaces  Integrate external memory and bus interfaces using available I/O and dedicated routing resources for system-level buffering.
• Prototyping and System Integration  Develop and validate mid-density designs that require a compact BGA package and a wide range of I/O options.

Unique Advantages

• Substantial Logic Resource: 50,528 logic elements provide designers with the capacity to implement complex state machines, datapaths and control logic without discrete FPGA overspec.
• Balanced On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces external memory dependence for buffering and small data storage.
• High I/O Count: 294 I/Os enable dense peripheral and bus interfaces, minimizing external interface components.
• Compact BGA Package: The 484-FBGA (23 × 23 mm) package provides a small footprint solution for space-constrained boards.
• Commercial-Grade Reliability: Designed and specified for 0 °C to 85 °C operation to meet a wide range of commercial applications.
• RoHS Compliant: Conforms to RoHS requirements to support regulatory and environmental objectives.

Why Choose EP2C50F484C7N?

The EP2C50F484C7N positions itself as a practical Cyclone II FPGA option for engineers who need a mid-density programmable device with a strong mix of logic, embedded memory and I/O capability in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of consumer and industrial-adjacent applications where proven Cyclone II architecture and supporting documentation are valuable.

Design teams looking for a cost-effective FPGA to implement embedded processing blocks, DSP functions or complex interfacing will find the EP2C50F484C7N delivers the key building blocks—logic elements, embedded RAM and a large I/O count—while adhering to a well-documented device family handbook for design and timing guidance.

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