EP2C50F484C8N

IC FPGA 294 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-BGA

Quantity 847 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O294Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50F484C8N – Cyclone® II FPGA, 484-BGA, 50,528 logic elements

The EP2C50F484C8N is an Intel Cyclone® II field-programmable gate array delivered in a compact 484-ball BGA (23×23) package. It provides a high-density programmable fabric with 50,528 logic elements and on-chip resources tailored for cost-sensitive embedded and DSP-centric designs.

Designed for commercial temperature applications, this surface-mount FPGA combines a low-voltage core, substantial I/O capacity, and family-level features such as global clock networks, PLL support, embedded multipliers, and embedded memory to accelerate custom logic, signal processing, and embedded processing projects.

Key Features

  • Logic Capacity  50,528 logic elements provide a scalable programmable fabric for complex custom logic and combinational/sequential functions.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) for buffering, FIFOs, and small data stores.
  • I/O Density  294 user I/O pins support extensive external connectivity for peripherals, memory interfaces, and board-level signals.
  • On‑chip DSP Support  Family-level support for embedded multipliers and DSP-oriented resources as documented in the Cyclone II device handbook.
  • Clocking and Timing  Global clock network and phase-locked loop (PLL) capabilities described for precise clock distribution and frequency control.
  • Power and Voltage  Core voltage supply range of 1.15 V to 1.25 V to match system power-rail designs.
  • Package and Mounting  484-ball FBGA (23×23) surface-mount package optimized for board-level density and thermal/power delivery.
  • Commercial Grade & Compliance  Specified for 0 °C to 85 °C operating temperature and RoHS-compliant for environmental regulatory requirements.

Typical Applications

  • Embedded Processing  Cost-sensitive embedded controllers and glue-logic implementations that benefit from programmable logic and on-chip memory.
  • DSP and Signal Processing  Fixed-point DSP tasks and arithmetic acceleration using the family’s embedded multipliers and memory resources.
  • Prototyping and Custom Logic  Hardware prototyping, custom peripheral integration, and interface bridging where reprogrammability speeds development cycles.
  • High‑I/O Systems  Board designs requiring substantial I/O count for sensors, interfaces, or parallel memory buses leverage the 294 I/Os.

Unique Advantages

  • High logic density: 50,528 logic elements enable integration of substantial custom logic into a single device, reducing board-level component count.
  • On-chip memory for buffering: Approximately 0.59 Mbits of embedded RAM support local data storage for FIFOs, frame buffers, and small caches, lowering external memory dependency.
  • Rich clocking features: Global clock networks and PLL support improve timing control across the design and simplify multi-clock-domain implementations.
  • Extensive I/O availability: 294 user I/Os allow flexible connections to a broad range of peripherals and external devices without external expanders.
  • Compact BGA package: The 484-ball FBGA (23×23) package delivers high pin count in a space-efficient footprint suitable for dense PCB layouts.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream commercial applications and regulatory conformity.

Why Choose EP2C50F484C8N?

The EP2C50F484C8N positions itself as a versatile Cyclone II family FPGA for designers needing significant logic capacity, on-chip memory, and broad I/O in a compact BGA footprint. Its combination of 50,528 logic elements, approximately 0.59 Mbits of embedded RAM, and family-level clocking and DSP resources suits a range of embedded processing and DSP-focused designs.

This device is a practical choice for teams seeking a commercially graded, programmable solution that balances integration and board-level density while leveraging the mature Cyclone II architecture and documentation for development and deployment.

Request a quote today to evaluate EP2C50F484C8N for your next embedded or signal-processing design; submit your specifications to receive pricing and lead-time information.

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