EP2C50F484C8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-BGA |
|---|---|
| Quantity | 847 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 294 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50F484C8N – Cyclone® II FPGA, 484-BGA, 50,528 logic elements
The EP2C50F484C8N is an Intel Cyclone® II field-programmable gate array delivered in a compact 484-ball BGA (23×23) package. It provides a high-density programmable fabric with 50,528 logic elements and on-chip resources tailored for cost-sensitive embedded and DSP-centric designs.
Designed for commercial temperature applications, this surface-mount FPGA combines a low-voltage core, substantial I/O capacity, and family-level features such as global clock networks, PLL support, embedded multipliers, and embedded memory to accelerate custom logic, signal processing, and embedded processing projects.
Key Features
- Logic Capacity 50,528 logic elements provide a scalable programmable fabric for complex custom logic and combinational/sequential functions.
- Embedded Memory Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) for buffering, FIFOs, and small data stores.
- I/O Density 294 user I/O pins support extensive external connectivity for peripherals, memory interfaces, and board-level signals.
- On‑chip DSP Support Family-level support for embedded multipliers and DSP-oriented resources as documented in the Cyclone II device handbook.
- Clocking and Timing Global clock network and phase-locked loop (PLL) capabilities described for precise clock distribution and frequency control.
- Power and Voltage Core voltage supply range of 1.15 V to 1.25 V to match system power-rail designs.
- Package and Mounting 484-ball FBGA (23×23) surface-mount package optimized for board-level density and thermal/power delivery.
- Commercial Grade & Compliance Specified for 0 °C to 85 °C operating temperature and RoHS-compliant for environmental regulatory requirements.
Typical Applications
- Embedded Processing Cost-sensitive embedded controllers and glue-logic implementations that benefit from programmable logic and on-chip memory.
- DSP and Signal Processing Fixed-point DSP tasks and arithmetic acceleration using the family’s embedded multipliers and memory resources.
- Prototyping and Custom Logic Hardware prototyping, custom peripheral integration, and interface bridging where reprogrammability speeds development cycles.
- High‑I/O Systems Board designs requiring substantial I/O count for sensors, interfaces, or parallel memory buses leverage the 294 I/Os.
Unique Advantages
- High logic density: 50,528 logic elements enable integration of substantial custom logic into a single device, reducing board-level component count.
- On-chip memory for buffering: Approximately 0.59 Mbits of embedded RAM support local data storage for FIFOs, frame buffers, and small caches, lowering external memory dependency.
- Rich clocking features: Global clock networks and PLL support improve timing control across the design and simplify multi-clock-domain implementations.
- Extensive I/O availability: 294 user I/Os allow flexible connections to a broad range of peripherals and external devices without external expanders.
- Compact BGA package: The 484-ball FBGA (23×23) package delivers high pin count in a space-efficient footprint suitable for dense PCB layouts.
- Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream commercial applications and regulatory conformity.
Why Choose EP2C50F484C8N?
The EP2C50F484C8N positions itself as a versatile Cyclone II family FPGA for designers needing significant logic capacity, on-chip memory, and broad I/O in a compact BGA footprint. Its combination of 50,528 logic elements, approximately 0.59 Mbits of embedded RAM, and family-level clocking and DSP resources suits a range of embedded processing and DSP-focused designs.
This device is a practical choice for teams seeking a commercially graded, programmable solution that balances integration and board-level density while leveraging the mature Cyclone II architecture and documentation for development and deployment.
Request a quote today to evaluate EP2C50F484C8N for your next embedded or signal-processing design; submit your specifications to receive pricing and lead-time information.

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