EP2C50F484I8N

IC FPGA 294 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-BGA

Quantity 181 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O294Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50F484I8N – Cyclone® II Field Programmable Gate Array (FPGA), 50,528 logic elements, 484-BGA

The EP2C50F484I8N is an Intel Cyclone® II FPGA delivered in a 484-ball BGA package. It implements the Cyclone II architecture to provide mid-range programmable logic capacity with embedded memory, flexible I/O, and on-chip system features suitable for embedded processing and DSP-oriented designs.

This device targets applications that require a balance of logic density, on-chip RAM, and extensive I/O count while meeting industrial operating-temperature requirements and RoHS compliance.

Key Features

  • Logic Capacity  Provides 50,528 logic elements for custom digital logic, control, and signal-processing functions.
  • Embedded Memory  Includes approximately 0.59 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for logic blocks.
  • I/O Density  294 I/O pins enable broad connectivity to external peripherals, memories, and interfaces.
  • Power Supply  Operates with a core voltage supply range of 1.15 V to 1.25 V, allowing integration with modern power-rail schemes.
  • Package & Mounting  Available in a 484-ball BGA (supplier package: 484-FBGA, 23×23) for surface-mount assembly and compact board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support industrial and harsh-environment applications.
  • Configuration & System Features  Cyclone II family features covered in the device handbook include on-chip configuration mechanisms, JTAG boundary-scan support, global clock network and PLL support, and hot-socketing considerations.
  • Signal Processing & Timing  The Cyclone II architecture documentation addresses embedded multipliers, flexible memory modes, and comprehensive clocking resources for timing-sensitive designs.
  • Compliance  RoHS-compliant design meets common environmental-safety requirements for electronic assemblies.

Typical Applications

  • Industrial Control  Implement custom motor-control logic, sensor aggregation, and field I/O handling within industrial automation systems, leveraging the device’s industrial temperature rating and wide I/O count.
  • Embedded Processing & DSP  Use the Cyclone II architecture’s embedded memory and multiplier resources for low-cost, on-board signal processing and protocol handling tasks.
  • High-Density Interface Bridging  Serve as a protocol bridge or interface controller where multiple parallel and serial peripherals must be aggregated across many I/O signals.
  • Prototyping & Custom Logic  Build and validate mid-range logic designs and custom accelerators that benefit from programmable fabric, on-chip RAM, and configurable clocking.

Unique Advantages

  • High logic capacity: 50,528 logic elements provide substantial room for implementing complex state machines, glue logic, and medium-scale datapaths.
  • Sizable on-chip RAM: Approximately 0.59 Mbits of embedded memory reduces reliance on external RAM for many buffering and small-memory needs.
  • Extensive I/O: 294 I/Os simplify board-level integration by supporting multiple interfaces and peripheral connections without additional multiplexing.
  • Industrial robustness: Rated from −40 °C to 100 °C for use in temperature-critical environments common to industrial electronics.
  • Compact BGA package: 484-BGA (484-FBGA, 23×23) enables a compact layout with reliable soldered connections for volume production.
  • Documented family features: Backed by Cyclone II device handbook material covering clocking, configuration, I/O standards, and system-level considerations to accelerate design integration.

Why Choose EP2C50F484I8N?

The EP2C50F484I8N positions itself as a practical, mid-range FPGA option for engineers who need a balance of logic density, embedded RAM, and wide I/O in a compact industrial-grade package. Its Cyclone II family heritage provides documented architectural features—such as flexible clocking, configuration, and on-chip resources—that facilitate integration into embedded, DSP, and control systems.

This device is well suited to teams designing cost-conscious, reliable hardware that requires programmable logic and local memory, offering a clear upgrade path within the Cyclone II device family and access to manufacturer documentation to support development and long-term deployment.

Request a quote or submit an inquiry to receive pricing, availability, and support information for EP2C50F484I8N.

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