EP2C50F484I8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-BGA |
|---|---|
| Quantity | 181 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 294 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50F484I8N – Cyclone® II Field Programmable Gate Array (FPGA), 50,528 logic elements, 484-BGA
The EP2C50F484I8N is an Intel Cyclone® II FPGA delivered in a 484-ball BGA package. It implements the Cyclone II architecture to provide mid-range programmable logic capacity with embedded memory, flexible I/O, and on-chip system features suitable for embedded processing and DSP-oriented designs.
This device targets applications that require a balance of logic density, on-chip RAM, and extensive I/O count while meeting industrial operating-temperature requirements and RoHS compliance.
Key Features
- Logic Capacity Provides 50,528 logic elements for custom digital logic, control, and signal-processing functions.
- Embedded Memory Includes approximately 0.59 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for logic blocks.
- I/O Density 294 I/O pins enable broad connectivity to external peripherals, memories, and interfaces.
- Power Supply Operates with a core voltage supply range of 1.15 V to 1.25 V, allowing integration with modern power-rail schemes.
- Package & Mounting Available in a 484-ball BGA (supplier package: 484-FBGA, 23×23) for surface-mount assembly and compact board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to support industrial and harsh-environment applications.
- Configuration & System Features Cyclone II family features covered in the device handbook include on-chip configuration mechanisms, JTAG boundary-scan support, global clock network and PLL support, and hot-socketing considerations.
- Signal Processing & Timing The Cyclone II architecture documentation addresses embedded multipliers, flexible memory modes, and comprehensive clocking resources for timing-sensitive designs.
- Compliance RoHS-compliant design meets common environmental-safety requirements for electronic assemblies.
Typical Applications
- Industrial Control Implement custom motor-control logic, sensor aggregation, and field I/O handling within industrial automation systems, leveraging the device’s industrial temperature rating and wide I/O count.
- Embedded Processing & DSP Use the Cyclone II architecture’s embedded memory and multiplier resources for low-cost, on-board signal processing and protocol handling tasks.
- High-Density Interface Bridging Serve as a protocol bridge or interface controller where multiple parallel and serial peripherals must be aggregated across many I/O signals.
- Prototyping & Custom Logic Build and validate mid-range logic designs and custom accelerators that benefit from programmable fabric, on-chip RAM, and configurable clocking.
Unique Advantages
- High logic capacity: 50,528 logic elements provide substantial room for implementing complex state machines, glue logic, and medium-scale datapaths.
- Sizable on-chip RAM: Approximately 0.59 Mbits of embedded memory reduces reliance on external RAM for many buffering and small-memory needs.
- Extensive I/O: 294 I/Os simplify board-level integration by supporting multiple interfaces and peripheral connections without additional multiplexing.
- Industrial robustness: Rated from −40 °C to 100 °C for use in temperature-critical environments common to industrial electronics.
- Compact BGA package: 484-BGA (484-FBGA, 23×23) enables a compact layout with reliable soldered connections for volume production.
- Documented family features: Backed by Cyclone II device handbook material covering clocking, configuration, I/O standards, and system-level considerations to accelerate design integration.
Why Choose EP2C50F484I8N?
The EP2C50F484I8N positions itself as a practical, mid-range FPGA option for engineers who need a balance of logic density, embedded RAM, and wide I/O in a compact industrial-grade package. Its Cyclone II family heritage provides documented architectural features—such as flexible clocking, configuration, and on-chip resources—that facilitate integration into embedded, DSP, and control systems.
This device is well suited to teams designing cost-conscious, reliable hardware that requires programmable logic and local memory, offering a clear upgrade path within the Cyclone II device family and access to manufacturer documentation to support development and long-term deployment.
Request a quote or submit an inquiry to receive pricing, availability, and support information for EP2C50F484I8N.

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