EP2C50F672C7N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA |
|---|---|
| Quantity | 761 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 450 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50F672C7N – Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA
The EP2C50F672C7N is an Intel Cyclone® II family FPGA providing mid-range programmable logic capacity and a flexible I/O complement for embedded and DSP-focused designs. It integrates a substantial logic fabric, embedded memory and a broad I/O count in a 672-ball BGA package for surface-mount applications.
This device is targeted at low-cost embedded processing and digital signal processing solutions where designers require 50k-level logic capacity, on-chip memory for buffering or state storage, and extensive I/O while operating in commercial temperature ranges.
Key Features
- Logic Capacity — 50,528 logic elements delivering significant programmable logic for mid-density designs; includes 3,158 LABs for block-level organization.
- Embedded Memory — Approximately 0.59 Mbits (594,432 bits) of on-chip RAM suitable for buffers, FIFOs and small on-chip data stores.
- I/O Resources — Up to 450 I/Os to support wide parallel interfaces, multiple peripherals or multi-bank I/O requirements.
- Package & Mounting — 672-BGA package (supplier device package: 672-FBGA (27x27)) optimized for surface-mount board designs.
- Power — Core voltage supply range of 1.15 V to 1.25 V to match Cyclone II core requirements.
- Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
- Standards & Family Features — Cyclone II architecture features such as global clock networks, PLL support, embedded multipliers, configurable I/O controls (programmable drive strength, slew rate, bus-hold and pull-up options), and configuration/JTAG support as documented for the family.
- Environmental Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Embedded Processing — Implement custom control and glue logic for consumer and industrial systems requiring programmable sequencing, offload or protocol handling.
- Digital Signal Processing — Support low-cost DSP implementations using the Cyclone II family’s embedded multipliers and memory for filtering, transforms and sample buffering.
- Memory Interface & Bridge Controllers — Act as an interface or controller for external memory and bus bridges leveraging the device’s routing and I/O flexibility.
- High‑I/O Peripheral Integration — Aggregate and interface multiple peripherals or parallel buses using the device’s large I/O count and configurable I/O features.
Unique Advantages
- High logic density at mid-range cost: 50,528 logic elements enable complex combinational and sequential logic without moving to larger device families.
- On-chip memory for compact designs: Approximately 0.59 Mbits of embedded RAM reduces external memory needs for many control and DSP tasks.
- Large I/O capacity: 450 I/Os allow flexible partitioning of interfaces and parallel connectivity for multi-channel designs.
- Industry-standard BGA packaging: 672-BGA (672-FBGA, 27×27) supports reliable, dense board-level integration for surface-mount manufacturing.
- Low-voltage core operation: Operates from 1.15 V to 1.25 V core supply, aligning with Cyclone II device requirements for efficient power design.
- Documented family features: The Cyclone II device handbook includes architecture details such as clock networks, PLLs, embedded multipliers, and I/O control options to help accelerate design and integration.
Why Choose EP2C50F672C7N?
The EP2C50F672C7N packages a balanced combination of logic density, embedded memory and I/O resources in a commercial-grade Cyclone II FPGA from Intel. It is well suited to engineers building cost-sensitive embedded processing and DSP applications that require mid-range programmable logic with versatile I/O and documented family-level features.
Choosing this device provides a straightforward path for designs that need scalable logic, on-chip RAM to reduce external component count, and a high I/O count in a standard BGA footprint—backed by Cyclone II family documentation and Intel’s device specifications.
Request a quote or submit an RFQ to check pricing and availability for the EP2C50F672C7N and plan lead times for your production schedule.

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