EP2C50F672C7N

IC FPGA 450 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA

Quantity 761 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O450Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50F672C7N – Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA

The EP2C50F672C7N is an Intel Cyclone® II family FPGA providing mid-range programmable logic capacity and a flexible I/O complement for embedded and DSP-focused designs. It integrates a substantial logic fabric, embedded memory and a broad I/O count in a 672-ball BGA package for surface-mount applications.

This device is targeted at low-cost embedded processing and digital signal processing solutions where designers require 50k-level logic capacity, on-chip memory for buffering or state storage, and extensive I/O while operating in commercial temperature ranges.

Key Features

  • Logic Capacity — 50,528 logic elements delivering significant programmable logic for mid-density designs; includes 3,158 LABs for block-level organization.
  • Embedded Memory — Approximately 0.59 Mbits (594,432 bits) of on-chip RAM suitable for buffers, FIFOs and small on-chip data stores.
  • I/O Resources — Up to 450 I/Os to support wide parallel interfaces, multiple peripherals or multi-bank I/O requirements.
  • Package & Mounting — 672-BGA package (supplier device package: 672-FBGA (27x27)) optimized for surface-mount board designs.
  • Power — Core voltage supply range of 1.15 V to 1.25 V to match Cyclone II core requirements.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
  • Standards & Family Features — Cyclone II architecture features such as global clock networks, PLL support, embedded multipliers, configurable I/O controls (programmable drive strength, slew rate, bus-hold and pull-up options), and configuration/JTAG support as documented for the family.
  • Environmental Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • Embedded Processing — Implement custom control and glue logic for consumer and industrial systems requiring programmable sequencing, offload or protocol handling.
  • Digital Signal Processing — Support low-cost DSP implementations using the Cyclone II family’s embedded multipliers and memory for filtering, transforms and sample buffering.
  • Memory Interface & Bridge Controllers — Act as an interface or controller for external memory and bus bridges leveraging the device’s routing and I/O flexibility.
  • High‑I/O Peripheral Integration — Aggregate and interface multiple peripherals or parallel buses using the device’s large I/O count and configurable I/O features.

Unique Advantages

  • High logic density at mid-range cost: 50,528 logic elements enable complex combinational and sequential logic without moving to larger device families.
  • On-chip memory for compact designs: Approximately 0.59 Mbits of embedded RAM reduces external memory needs for many control and DSP tasks.
  • Large I/O capacity: 450 I/Os allow flexible partitioning of interfaces and parallel connectivity for multi-channel designs.
  • Industry-standard BGA packaging: 672-BGA (672-FBGA, 27×27) supports reliable, dense board-level integration for surface-mount manufacturing.
  • Low-voltage core operation: Operates from 1.15 V to 1.25 V core supply, aligning with Cyclone II device requirements for efficient power design.
  • Documented family features: The Cyclone II device handbook includes architecture details such as clock networks, PLLs, embedded multipliers, and I/O control options to help accelerate design and integration.

Why Choose EP2C50F672C7N?

The EP2C50F672C7N packages a balanced combination of logic density, embedded memory and I/O resources in a commercial-grade Cyclone II FPGA from Intel. It is well suited to engineers building cost-sensitive embedded processing and DSP applications that require mid-range programmable logic with versatile I/O and documented family-level features.

Choosing this device provides a straightforward path for designs that need scalable logic, on-chip RAM to reduce external component count, and a high I/O count in a standard BGA footprint—backed by Cyclone II family documentation and Intel’s device specifications.

Request a quote or submit an RFQ to check pricing and availability for the EP2C50F672C7N and plan lead times for your production schedule.

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