EP2C50F672C8N

The EP2C50F672C8N is a Cyclone II family FPGA offering a mid-range logic capacity and integrated on-chip memory in a compact 672-ball BGA package. It combines a dense array of logic elements and LABs with embedded memory, multiplier resources and a flexible I/O complement suited for low-cost embedded processing and DSP-focused designs.

Designed for commercial-temperature applications, this device targets system designs that require moderate logic density, substantial I/O count and on-chip resources while maintaining a narrow core-voltage range for power-sensitive implementations.

Key Features

• Cyclone II FPGA architecture Proven programmable-logic architecture with global clock network and PLL support for managed clocking and synchronization.
• Logic resources 3,158 LABs providing a total of 50,528 logic elements for implementing custom logic, control and datapath functions.
• Embedded memory Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) organized for efficient storage and buffering in embedded designs.
• DSP support Integrated multiplier resources and DSP-oriented routing for low-cost signal processing and arithmetic acceleration.
• I/O capability 450 available I/O pins with support for the Cyclone II I/O structure and multi-voltage I/O interfaces to connect sensors, peripherals and external memory.
• Configuration & test features JTAG (IEEE 1149.1) boundary-scan and flexible configuration schemes as documented in the Cyclone II Device Handbook.
• Power and supply Core voltage supply range of 1.15 V to 1.25 V to match system power rails and minimize external power conversion complexity.
• Package & mounting 672-ball FBGA (27 × 27 mm) surface-mount package for high-density PCB implementations.
• Operating range & compliance Commercial grade operation from 0 °C to 85 °C and RoHS-compliant packaging.

Typical Applications

• Low-cost embedded processing — Implements custom control logic, protocol handling and peripheral aggregation where integrated logic and memory reduce BOM count.
• Digital signal processing — Uses embedded multipliers and on-chip RAM for filtering, transforms and other DSP tasks in cost-sensitive systems.
• Interface bridging and I/O expansion — High I/O count enables bridging between multiple peripherals, buses and sensors without extensive external logic.
• Prototyping and system validation — FPGA flexibility supports iterative hardware/firmware co-development and early system integration testing.

Unique Advantages

• Balanced logic and memory mix: Combines over 50k logic elements with approximately 0.59 Mbits of embedded RAM to implement control, buffering and processing on a single device.
• High I/O density: 450 I/O pins enable direct connection to a wide range of peripherals and parallel interfaces, simplifying board-level design.
• Integrated clocking and DSP features: Global clock network, PLLs and embedded multipliers provide on-chip resources for timing control and arithmetic acceleration without external IP cores.
• Compact, assembly-friendly package: 672-FBGA (27×27) surface-mount package optimizes PCB area while supporting high pin counts.
• Documented design ecosystem: Supported by the Cyclone II Device Handbook and accompanying documentation to accelerate implementation and validation.
• Regulatory friendliness: RoHS-compliant construction eases integration into commercial electronic products.

Why Choose EP2C50F672C8N?

The EP2C50F672C8N positions itself as a capable Cyclone II FPGA for designs that need a practical balance of logic density, embedded memory and high I/O in a compact BGA package. Its combination of LAB-based logic, on-chip RAM, multiplier resources and FPGA clocking features makes it suitable for low-cost embedded processing and DSP-oriented applications where integration and board-level simplification matter.

Engineers and procurement teams will find this device appropriate for mid-range FPGA deployments that benefit from the Cyclone II family documentation and configuration options, enabling faster development cycles and predictable system behavior within commercial-temperature environments.

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