EP2C50F672I8N

IC FPGA 450 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA

Quantity 653 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BGANumber of I/O450Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50F672I8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA

The EP2C50F672I8N is an Intel Cyclone® II FPGA offered in a 672-ball BGA package, designed for industrial applications that require medium-density programmable logic, substantial on-chip memory, and high I/O capacity. Its architecture supports a range of embedded processing, control and I/O-centric designs where predictable voltage and temperature operating windows are important.

This device provides 50,528 logic elements, approximately 0.59 Mbits of embedded memory, and 450 I/O pins, enabling compact, integrated implementations for industrial control, embedded processing, and high-density interface tasks.

Key Features

  • Logic Capacity: 50,528 logic elements suitable for medium-density FPGA designs and complex glue logic implementations.
  • Embedded Memory: Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) for buffering, FIFOs, and small embedded data storage.
  • I/O Density: 450 user I/Os to support multiple parallel interfaces, peripheral connections, and external memory or sensor buses.
  • Power Supply: Narrow core voltage range of 1.15 V to 1.25 V for the device core, allowing deterministic power planning in multi-rail systems.
  • Package & Mounting: 672-ball BGA package (supplier device package: 672-FBGA, 27×27); surface-mount mounting for PCB integration.
  • Industrial Operating Range: Rated for -40 °C to 100 °C operating temperature, matching common industrial environment requirements.
  • Family-Level Resources: Cyclone II family architecture includes features such as a global clock network and phase-locked loops (PLLs), embedded multipliers, M4K memory blocks, and JTAG boundary-scan/configuration support as documented in the device handbook.
  • Compliance: RoHS compliant to support environmentally conscious designs and regulatory requirements.

Typical Applications

  • Industrial Control & Automation: Use the device's industrial temperature rating and I/O capacity for motor control logic, sensor aggregation, and machine interface functions.
  • Embedded Processing: Implement application-specific processors, custom peripherals, and control logic using the device’s logic elements and embedded memory.
  • High-Density I/O Systems: Take advantage of 450 I/Os for dense interface requirements such as multi-channel data acquisition, expansion cards, or parallel bus bridging.
  • Digital Signal Processing (DSP): Leverage family-level embedded multipliers and on-chip memory to implement medium-complexity DSP tasks within system constraints.

Unique Advantages

  • Substantial Logic Resources: 50,528 logic elements provide the capacity to integrate multiple functions into a single device, reducing board-level complexity.
  • Integrated Memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external buffering and supports tighter system integration.
  • High I/O Count: 450 I/Os enable direct interfacing to a wide array of peripherals and parallel interfaces without additional IO expanders.
  • Industrial Reliability: Specified -40 °C to 100 °C operating temperature suits sustained operation in industrial environments.
  • Compact BGA Packaging: 672-ball BGA (27×27) provides a high pin-count solution in a compact footprint for space-constrained PCBs.
  • Standards and Compliance: RoHS compliance supports regulatory and sustainability goals in product design.

Why Choose EP2C50F672I8N?

The EP2C50F672I8N positions itself as a pragmatic choice for engineers requiring a mid-range Cyclone II FPGA that balances logic capacity, embedded memory, and extensive I/O in an industrial-temperature-rated package. Its defined core voltage window and BGA packaging simplify power and board-level planning for production designs.

This device is suited for design teams building compact, integrated systems in industrial control, embedded processing, and I/O-dense applications where predictable electrical and thermal behavior and RoHS compliance are required. The Cyclone II family documentation further details family-level features such as PLLs, embedded multipliers, and M4K memory blocks that support design implementation and verification.

Request a quote or submit an inquiry to obtain pricing, availability, and additional ordering information for EP2C50F672I8N.

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