EP2C50F672I8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA |
|---|---|
| Quantity | 653 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 450 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50F672I8N – Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA
The EP2C50F672I8N is an Intel Cyclone® II FPGA offered in a 672-ball BGA package, designed for industrial applications that require medium-density programmable logic, substantial on-chip memory, and high I/O capacity. Its architecture supports a range of embedded processing, control and I/O-centric designs where predictable voltage and temperature operating windows are important.
This device provides 50,528 logic elements, approximately 0.59 Mbits of embedded memory, and 450 I/O pins, enabling compact, integrated implementations for industrial control, embedded processing, and high-density interface tasks.
Key Features
- Logic Capacity: 50,528 logic elements suitable for medium-density FPGA designs and complex glue logic implementations.
- Embedded Memory: Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) for buffering, FIFOs, and small embedded data storage.
- I/O Density: 450 user I/Os to support multiple parallel interfaces, peripheral connections, and external memory or sensor buses.
- Power Supply: Narrow core voltage range of 1.15 V to 1.25 V for the device core, allowing deterministic power planning in multi-rail systems.
- Package & Mounting: 672-ball BGA package (supplier device package: 672-FBGA, 27×27); surface-mount mounting for PCB integration.
- Industrial Operating Range: Rated for -40 °C to 100 °C operating temperature, matching common industrial environment requirements.
- Family-Level Resources: Cyclone II family architecture includes features such as a global clock network and phase-locked loops (PLLs), embedded multipliers, M4K memory blocks, and JTAG boundary-scan/configuration support as documented in the device handbook.
- Compliance: RoHS compliant to support environmentally conscious designs and regulatory requirements.
Typical Applications
- Industrial Control & Automation: Use the device's industrial temperature rating and I/O capacity for motor control logic, sensor aggregation, and machine interface functions.
- Embedded Processing: Implement application-specific processors, custom peripherals, and control logic using the device’s logic elements and embedded memory.
- High-Density I/O Systems: Take advantage of 450 I/Os for dense interface requirements such as multi-channel data acquisition, expansion cards, or parallel bus bridging.
- Digital Signal Processing (DSP): Leverage family-level embedded multipliers and on-chip memory to implement medium-complexity DSP tasks within system constraints.
Unique Advantages
- Substantial Logic Resources: 50,528 logic elements provide the capacity to integrate multiple functions into a single device, reducing board-level complexity.
- Integrated Memory: Approximately 0.59 Mbits of embedded RAM reduces the need for external buffering and supports tighter system integration.
- High I/O Count: 450 I/Os enable direct interfacing to a wide array of peripherals and parallel interfaces without additional IO expanders.
- Industrial Reliability: Specified -40 °C to 100 °C operating temperature suits sustained operation in industrial environments.
- Compact BGA Packaging: 672-ball BGA (27×27) provides a high pin-count solution in a compact footprint for space-constrained PCBs.
- Standards and Compliance: RoHS compliance supports regulatory and sustainability goals in product design.
Why Choose EP2C50F672I8N?
The EP2C50F672I8N positions itself as a pragmatic choice for engineers requiring a mid-range Cyclone II FPGA that balances logic capacity, embedded memory, and extensive I/O in an industrial-temperature-rated package. Its defined core voltage window and BGA packaging simplify power and board-level planning for production designs.
This device is suited for design teams building compact, integrated systems in industrial control, embedded processing, and I/O-dense applications where predictable electrical and thermal behavior and RoHS compliance are required. The Cyclone II family documentation further details family-level features such as PLLs, embedded multipliers, and M4K memory blocks that support design implementation and verification.
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