EP2C50F672C8

The EP2C50F672C8 is an Intel Cyclone® II field-programmable gate array (FPGA) delivering a balanced combination of programmable logic, on-chip memory, and extensive I/O in a compact 672-ball BGA. Designed for cost-sensitive embedded and DSP-focused designs, this Cyclone II device targets applications that require significant logic density, memory resources, and flexible I/O connectivity.

With 50,528 logic elements, approximately 0.6 Mbits of embedded RAM, and 450 I/Os, the device supports complex control, signal-processing, and interface tasks while operating at a low core voltage (1.15 V to 1.25 V) in commercial temperature ranges.

Key Features

• Logic Capacity — 50,528 logic elements providing substantial programmable resources for combinational and sequential logic implementations.
• Logic Array Blocks (LABs) — 3,158 LABs for organized placement of logic functions and predictable synthesis mapping.
• Embedded Memory — Approximately 0.6 Mbits of on-chip RAM (594,432 bits) for data buffering, FIFOs, and small on-chip storage.
• High I/O Count — 450 user I/Os to support multiple parallel interfaces, bus systems, and mixed-signal front-end connections.
• Clocking and DSP Primitives — Family-level features include a global clock network, phase-locked loops (PLLs), and embedded multipliers for timing flexibility and DSP acceleration.
• Package and Mounting — 672-BGA (supplier package: 672-FBGA, 27 × 27) in a surface-mount form factor suitable for dense board designs.
• Power and Thermal — Low-voltage core operation from 1.15 V to 1.25 V and commercial operating temperature from 0 °C to 85 °C.
• Standards and Compliance — RoHS-compliant device meeting regulatory material requirements for lead-free manufacturing.

Typical Applications

• Embedded Processing — Implement soft processors, custom control logic, and glue-logic for system-level control and protocol handling.
• DSP and Signal Processing — Use embedded multipliers and local RAM for filtering, transforms, and real-time data processing.
• High‑Density I/O Interfaces — Support multi-channel sensor arrays, parallel buses, and interface bridging with 450 available I/Os.
• Memory and Periphery Interfaces — Integrate external memory controllers and perimeter logic leveraging the device's routing and I/O capabilities.

Unique Advantages

• Substantial Logic Resource: 50,528 logic elements enable large-scale custom logic implementations without immediate migration to higher-tier devices.
• Integrated On-Chip Memory: Approximately 0.6 Mbits of embedded RAM reduces the need for external memory for buffering and small datasets.
• Extensive I/O Count: 450 I/Os simplify board-level designs that require many parallel connections or multiple interface standards.
• Flexible Clocking and DSP Support: Family-level PLLs and embedded multipliers provide architectural building blocks for timing control and signal-processing tasks.
• Compact Packaging: The 672-BGA (27 × 27) FBGA package supports high-density PCB layouts while maintaining surface-mount compatibility.
• Regulatory Compatibility: RoHS compliance supports lead-free manufacturing processes and materials requirements.

Why Choose EP2C50F672C8?

The EP2C50F672C8 Cyclone II FPGA offers a practical balance of logic density, embedded memory, and I/O capacity for commercial embedded and DSP designs. Its combination of 50,528 logic elements, approximately 0.6 Mbits of RAM, and 450 I/Os in a compact 672-BGA package makes it well suited for projects that require significant on-chip resources while maintaining a low-voltage core and standard commercial operating temperatures.

Choose this device when you need a dependable, field-programmable platform supported by the Cyclone II family architecture—providing organized LAB-based logic, integrated clocking and DSP primitives, and compliance with RoHS material standards for long-term manufacturability and deployment.

Request a quote or submit an inquiry for availability and pricing to move your design from concept to production with the EP2C50F672C8.