EP2C50U484C6
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-FBGA |
|---|---|
| Quantity | 1,600 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 294 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50U484C6 – Cyclone® II FPGA, 50,528 logic elements, 484-FBGA
The EP2C50U484C6 is a Cyclone® II Field Programmable Gate Array (FPGA) IC from Intel, delivering 50,528 logic elements in a compact 484-FBGA (484-UBGA, 19×19) surface-mount package. Designed for commercial-grade embedded and DSP-focused applications, this device combines significant logic capacity, on-chip memory, and flexible I/O to address low-cost embedded processing and DSP use cases.
With approximately 0.6 Mbits of embedded memory and 294 user I/O pins, the EP2C50U484C6 supports sophisticated logic designs, external memory interfacing and high-density I/O integration while operating from a low-voltage core supply (1.15 V to 1.25 V) across a commercial temperature range (0 °C to 85 °C).
Key Features
- Core Logic 50,528 logic elements provide a substantial programmable fabric for custom logic, control and signal processing functions.
- Embedded Memory Approximately 0.6 Mbits of on-chip RAM for lookup tables, FIFOs and buffering to support data-path and control implementations.
- I/O Capacity & Flexibility 294 user I/O pins in a multi‑bank architecture support a wide range of interfaces; datasheet details include advanced I/O standards, differential interfaces and programmable drive strength.
- Clocking & Timing Resources Integrated global clock network and phase-locked loop (PLL) support for flexible clock distribution and timing management across the device.
- DSP & Arithmetic Support Embedded multiplier resources and multiplier routing interfaces enable efficient implementation of multiply-accumulate and DSP functions.
- Configuration & Test IEEE 1149.1 (JTAG) boundary-scan support and multiple configuration schemes simplify programming, debugging and production test flows.
- Power & Operating Conditions Low-voltage core operation (1.15 V–1.25 V) and commercial temperature grade (0 °C to 85 °C) for typical embedded system environments.
- Package & Mounting 484-FBGA (484-UBGA, 19×19) surface-mount package provides a compact footprint for high-density board designs while meeting RoHS compliance.
Typical Applications
- Embedded Processing Low-cost embedded systems that require configurable control logic, protocol handling and on-chip memory for local data buffering.
- DSP Acceleration Signal processing tasks that benefit from embedded multipliers and a large logic fabric for implementing filters, transforms and MAC-heavy algorithms.
- Memory Interface & Bridging External memory interfacing and protocol translation roles that leverage the device’s I/O density and documented external memory support.
- High-Density I/O Applications Systems requiring numerous parallel interfaces or mixed-voltage I/O signalling where programmable drive strength and I/O standard support are important.
Unique Advantages
- High Logic Density: 50,528 logic elements enable complex custom logic and state machines without immediately moving to larger device families.
- Significant On-Chip Memory: Approximately 0.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
- Flexible I/O and Board Integration: 294 I/O pins in a 484-FBGA package provide high connectivity in a compact surface-mount form factor for space-constrained designs.
- Low-Voltage Core: 1.15 V–1.25 V supply supports designs optimized for lower-power core operation and modern power-management schemes.
- Configuration and Testability: JTAG boundary-scan and multiple configuration options facilitate production testing, field updates and system debug.
- RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and compliance programs.
Why Choose EP2C50U484C6?
The EP2C50U484C6 positions itself as a practical solution for commercial embedded and DSP designs that require a balance of logic capacity, on-chip memory and high I/O density in a compact FBGA package. Its combination of 50,528 logic elements, approximately 0.6 Mbits of embedded RAM and 294 I/Os makes it well suited to applications that need substantial programmable logic and flexible interfacing without exceeding the constraints of a commercial-grade device.
Engineers and procurement teams looking for a Cyclone® II family FPGA with documented architecture features—such as global clock networks, PLLs, embedded multipliers, advanced I/O support and JTAG testability—will find the EP2C50U484C6 to be a capable, RoHS-compliant option for developing and deploying cost-sensitive, performance-focused designs.
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