EP2C50F672I8

The EP2C50F672I8 is a Cyclone® II family FPGA from Intel designed for mid-density, programmable logic applications. It combines a substantial logic fabric with embedded memory and broad I/O capacity, delivered in a 672‑ball BGA package for space-efficient board integration.

Typical use cases reflected in the Cyclone II device handbook include low-cost embedded processing and DSP solutions; the device’s combination of logic resources, on-chip memory and high I/O count targets designs that require integration and flexibility within an industrial operating range.

Key Features

• Core Logic 50,528 logic elements providing the programmable fabric required for integrated control, glue logic and custom datapaths.
• Embedded Memory Approximately 0.59 Mbits (594,432 bits) of on-chip RAM to support buffering, FIFOs and small local storage without external memory.
• I/O Capacity & Flexibility 450 user I/Os to accommodate wide parallel interfaces, multiple I/O banks and extensive external peripheral connectivity. The Cyclone II family documentation includes support for advanced I/O standards and high‑speed differential interfaces.
• Power Supply Core voltage range of 1.15 V to 1.25 V to match system power rails and ensure predictable core operation.
• Package 672‑ball BGA (supplier package: 672‑FBGA, 27 × 27) for compact, high‑density PCB layouts.
• Operating Range & Grade Industrial grade with an operating temperature range from −40 °C to 100 °C for deployment in temperature‑demanding environments.
• Standards & Compliance RoHS‑compliant product status indicating conformity with lead‑free manufacturing requirements.

Typical Applications

• Embedded Processing & Control Implement soft processors, peripheral controllers and custom control logic using the device’s logic capacity and on‑chip memory.
• DSP and Signal Processing Use the Cyclone II architecture to build low‑cost DSP pipelines and fixed‑point processing blocks, leveraging the device handbook material on multiplier and memory modes.
• High‑Density I/O Systems Interface to multiple parallel peripherals, sensor arrays or I/O‑rich subsystems with up to 450 user I/Os and banked I/O support.
• Memory Interface & Prototyping Implement external memory controllers and interface logic using the device’s embedded RAM and documented external memory interfacing features.

Unique Advantages

• High logic capacity: 50,528 logic elements enable integration of multiple functions on a single device, reducing board-level component count.
• Significant embedded memory: Approximately 0.59 Mbits of on‑chip RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O resources: 450 I/Os support complex multi‑device interfaces and parallel connectivity for sensor, display and bus subsystems.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in harsher environments common in industrial applications.
• Compact package: 672‑ball BGA (27 × 27) saves PCB area while enabling high pin count routing.
• Proven device family documentation: Delivered as part of the Cyclone II device handbook, providing detailed architecture, configuration and I/O guidance for design integration.

Why Choose EP2C50F672I8?

The EP2C50F672I8 offers a balanced combination of logic density, embedded memory and abundant I/O in a compact BGA package—making it suitable for engineers who need integrated programmable logic for embedded processing, DSP tasks and complex I/O systems. Its industrial temperature rating and documented Cyclone II architecture provide a reliable foundation for designs that require stable operation across a wide thermal range.

Backed by the Cyclone II device handbook and Intel/Altera device documentation, this part supports straightforward design integration, scalability within the Cyclone II family, and predictable behavior tied to the published voltage and temperature specifications.

Request a quote or contact sales to check pricing, availability and to discuss how the EP2C50F672I8 can fit your next design.