EP2C50F672C7

The EP2C50F672C7 is an Intel Cyclone® II family FPGA that delivers a balanced combination of programmable logic capacity, on‑chip memory, and high I/O density in a compact 672‑FBGA package. The Cyclone II architecture is presented in the device handbook as a low‑cost platform for embedded processing and DSP solutions.

This device targets commercial‑grade applications requiring significant logic resources — including 50,528 logic elements and approximately 0.59 Mbits of embedded memory — together with up to 450 I/O pins for dense system interfacing. The device operates on a 1.15 V to 1.25 V core supply and is rated for 0 °C to 85 °C operation.

Key Features

• Core Architecture  50,528 logic elements providing programmable logic density for complex designs; documented Cyclone II architecture supports embedded processing and DSP modes.
• Logic Array Blocks (LABs)  Device includes 3,158 LABs for structured placement and routing of logic functions.
• Embedded Memory  Approximately 0.59 Mbits of on‑chip RAM for FIFOs, buffers, and small local storage.
• I/O Capacity  Up to 450 I/O pins to support wide parallel buses, multiple interfaces, or high‑pin‑count peripherals.
• Power Supply  Core voltage supply range of 1.15 V to 1.25 V to match system power envelopes and ensure stable core operation.
• Package & Mounting  Supplied in a 672‑FBGA (27×27) package with surface‑mount mounting for compact PCB integration.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C suitable for a wide set of commercial and industrial environments.
• Standards & Compliance  RoHS compliant, meeting lead‑free environmental requirements.

Unique Advantages

• Substantial logic capacity: 50,528 logic elements enable consolidation of multiple functions into a single device, reducing system BOM.
• On‑chip memory for buffering: Approximately 0.59 Mbits of embedded RAM supports local data storage and high‑throughput data paths without external memory.
• High I/O density: 450 available I/O pins allow flexible interfacing to parallel buses, sensors, and external peripherals.
• Compact BGA footprint: 672‑FBGA (27×27) packaging delivers a high pin count in a space‑efficient surface‑mount form factor.
• Commercial temperature rating: 0 °C to 85 °C provides suitability for a broad range of commercial applications.
• Environmental compliance: RoHS compliance supports designs that require lead‑free components.

Why Choose EP2C50F672C7?

The EP2C50F672C7 provides a practical balance of programmable logic, embedded memory, and dense I/O in a compact 672‑FBGA package. Its Cyclone II architecture and documented support for embedded processing and DSP use cases make it a strong option for commercial designs that need significant on‑chip resources without introducing unnecessary complexity.

Choose this device when your design requires a large pool of logic elements, meaningful embedded RAM, and extensive I/O while maintaining a surface‑mount BGA footprint and commercial‑grade operating range.

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