EP2C50F672C6N

IC FPGA 450 I/O 672FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 450 594432 50528 672-BGA

Quantity 773 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O450Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50F672C6N – Cyclone® II Field Programmable Gate Array (FPGA) 672-BGA, 50,528 logic elements

The EP2C50F672C6N is an Intel Cyclone® II family FPGA designed for low-cost embedded processing and DSP-oriented applications. It integrates a large logic fabric with on-chip memory and DSP-friendly resources to support compact, cost-sensitive system designs.

Built with a 672-pin BGA package and support for a wide set of I/O and clocking features described in the Cyclone II device handbook, this commercial-grade device targets applications that require dense logic, flexible I/O, and integrated memory and multiplier resources.

Key Features

  • Core Logic  50,528 logic elements provide substantial programmable fabric for combinational and sequential logic implementation.
  • Embedded Memory  Approximately 0.59 Mbits of on-chip RAM (594,432 total RAM bits) organized for versatile memory modes and M4K routing interfaces.
  • DSP & Arithmetic  Integrated embedded multipliers and multiplier routing support for DSP-oriented arithmetic and acceleration functions as documented for the Cyclone II family.
  • I/O Capacity & Flexibility  450 user I/O pins with support for advanced I/O standards, programmable drive strengths, slew-rate control, and series on‑chip termination options covered in the Cyclone II I/O structure.
  • Clocking & Timing  Global clock network and phase-locked loop (PLL) support described in the device handbook enable structured clock distribution and clock management across the design.
  • Package & Mounting  672-BGA (supplier package: 672-FBGA, 27×27) surface-mount package suitable for high-density board layouts.
  • Power & Supply  Nominal core supply range of 1.15 V to 1.25 V to match Cyclone II device requirements.
  • Commercial Grade & Environmental  Commercial grade device with operating temperature range 0 °C to 85 °C and RoHS compliance for environmental regulation adherence.

Typical Applications

  • Embedded Processing  Implement compact embedded controllers, state machines, and system glue logic using the device’s dense logic fabric and on-chip memory.
  • DSP Acceleration  Use the embedded multipliers and memory organization to accelerate digital signal processing tasks in low-cost DSP solutions.
  • High-Density I/O Systems  Leverage 450 I/Os and programmable I/O features to build interfaces for sensors, peripherals, or parallel bus systems.
  • External Memory Interfacing  Utilize documented external memory interfacing capabilities from the Cyclone II handbook for designs that require off-chip memory access.

Unique Advantages

  • Highly integrated logic and memory: 50,528 logic elements and approximately 0.59 Mbits of embedded memory reduce the need for multiple discrete components.
  • DSP-capable resources: Embedded multipliers and memory modes provide on-chip building blocks for signal processing tasks without external accelerators.
  • Flexible I/O implementation: 450 I/Os with programmable drive strength, slew control, and on‑chip termination options support a wide range of interface requirements.
  • Structured clocking: Global clock network and PLL support enable disciplined clock distribution for synchronous systems.
  • Commercial-grade, RoHS compliant package: 672-BGA surface-mount package with RoHS compliance simplifies design-in for standard commercial applications.

Why Choose EP2C50F672C6N?

The EP2C50F672C6N provides a balanced combination of dense programmable logic, embedded memory, DSP-friendly multiplier resources, and flexible I/O in a compact 672-BGA package. It is positioned for designers building cost-sensitive embedded and DSP solutions who require on-chip integration to reduce board-level complexity.

Backed by the Cyclone II device handbook and Intel (Altera) device documentation, this FPGA is suitable for commercial applications that need reliable programmable logic, documented clocking and I/O features, and RoHS compliance.

Request a quote or submit a pricing inquiry for EP2C50F672C6N to review availability and specific purchasing options.

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