EP2C50U484C8

The EP2C50U484C8 is an Intel Cyclone® II FPGA offered in a 484-ball FBGA package, designed for low-cost embedded processing and DSP-oriented applications. It combines a high logic capacity with abundant I/O and on-chip memory to support system integration where cost, power efficiency, and moderate performance are priorities.

This device targets commercial-grade applications that require flexible logic resources, multiple interface options, and a compact surface-mount package with a core voltage supply between 1.15 V and 1.25 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 50,528 logic elements organized across 3,158 LABs, enabling implementation of complex combinational and sequential logic functions.
• Embedded Memory — Approximately 0.57 Mbits of on-chip RAM (594,432 total RAM bits) for FIFOs, buffers, and local storage to support embedded processing and data buffering.
• I/O and Interface Flexibility — 294 user I/O pins with documented I/O structure and programmable drive features to support a variety of single-ended and differential interfaces and external memory connections.
• Clocking and Timing — Dedicated global clock network and Phase-Locked Loop (PLL) resources for disciplined clock distribution and timing control across the design.
• Embedded DSP Resources — Integrated embedded multipliers and dedicated routing to support DSP and arithmetic-intensive functions within the Cyclone II architecture.
• Package and Mounting — Surface-mount 484-FBGA package (supplier package: 484-UBGA, 19×19) for space-constrained board designs.
• Power and Thermal — Supported core supply voltage range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C.
• Standards and Compliance — RoHS-compliant manufacturing and materials.

Typical Applications

• Embedded Processing — Implement soft processors, control logic, and glue-logic functions using the device’s logic elements and on-chip memory for compact system designs.
• DSP and Signal Processing — Use embedded multipliers and dedicated routing to implement filtering, transforms, and arithmetic pipelines for moderate-performance DSP tasks.
• Interface Bridging — Leverage 294 I/Os and programmable I/O features to connect disparate peripherals, external memory, or communication interfaces.
• Memory Interfacing — Use the device’s external memory interfacing capabilities and on-chip RAM to implement buffering and controller logic for external memory subsystems.

Unique Advantages

• High Logic Density: 50,528 logic elements provide substantial capacity to consolidate multiple functions into a single FPGA, reducing PCB BOM and board area.
• Integrated Memory Resources: Approximately 0.57 Mbits of embedded RAM allow local data storage and buffering without immediate reliance on external memory.
• Extensive I/O Count: 294 I/O pins support complex multi-channel interfaces and give designers flexibility in system partitioning.
• Dedicated Clocking and PLLs: Global clock network and PLL resources enable controlled clock distribution and frequency synthesis for synchronous designs.
• Compact, Surface-Mount Package: The 484-FBGA (484-UBGA, 19×19) form factor suits space-constrained assemblies while providing a high pin count.
• Regulatory and Manufacturing Readiness: RoHS-compliant construction supports environmental and production requirements for commercial applications.

Why Choose EP2C50U484C8?

The EP2C50U484C8 positions itself as a cost-conscious Cyclone II FPGA option that balances sizable logic resources, embedded memory, and flexible I/O in a compact FBGA package. Its combination of 50,528 logic elements, substantial on-chip RAM, and dedicated DSP and clocking features makes it suitable for designers consolidating control, interface, and moderate DSP functions into a single programmable device.

This device is well suited to commercial embedded designs that require scalable logic capacity, routine operating temperature support, and RoHS compliance. It provides a reliable platform for teams looking to optimize board-level integration while leveraging the Cyclone II device family architecture and documentation.

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