EP2C50U484I8

IC FPGA 294 I/O 484UBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-FBGA

Quantity 97 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGANumber of I/O294Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3158Number of Logic Elements/Cells50528
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits594432

Overview of EP2C50U484I8 – Cyclone® II Field Programmable Gate Array (FPGA) IC

The EP2C50U484I8 is a Cyclone® II FPGA device offering a mid-range FPGA fabric with substantial on-chip resources for embedded processing and signal processing applications. It combines a high count of logic elements and dedicated on-chip memory with a wide I/O complement in a compact 484-ball FBGA package targeted at industrial applications.

Typical use cases include low-cost embedded processing and DSP-centric designs where deterministic I/O and moderate logic and memory resources are required. The device supports industrial operating conditions and a narrow core supply range to meet system design requirements.

Key Features

  • Logic Capacity — 50,528 logic elements provide a large programmable fabric for implementing complex control, datapath, and glue-logic functions.
  • Logic Array Blocks — 3,158 logic array blocks (LABs) for structured logic organization and efficient mapping of designs across the device.
  • Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (594,432 total bits) to support buffering, FIFOs, and small on-chip data stores without external memory.
  • I/O Density — 294 I/O pins to accommodate parallel interfaces, external memory buses, and system control signals.
  • Power Supply Range — Core voltage supply from 1.15 V to 1.25 V suitable for Cyclone II power domains.
  • Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C to meet industrial temperature requirements.
  • Package — 484-ball FBGA package; supplier device package listed as 484-UBGA (19×19) for compact board-level integration.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Low-Cost Embedded Processing — Implement control logic, soft processors, and custom peripherals using the device’s logic capacity and embedded memory.
  • DSP and Signal Processing — Support low-cost DSP solutions leveraging the Cyclone II architecture for arithmetic and data-path implementations.
  • External Memory Interface Designs — Use the device’s I/O complement and architecture for designs that interface with external memories and parallel buses.

Unique Advantages

  • High Logic Integration: 50,528 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
  • Substantial On-Chip RAM: Approximately 0.59 Mbits of embedded memory reduces reliance on external RAM for buffering and small data stores.
  • Generous I/O Count: 294 I/O pins allow flexible system interfacing and support for wide parallel buses or multiple interfaces.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
  • Compact, Assembly-Friendly Package: 484-FBGA / 484-UBGA (19×19) packaging delivers a space-efficient footprint for dense board designs.
  • Vendor Documentation: Supported by Cyclone II device handbook documentation for architecture, configuration, and timing guidance.

Why Choose EP2C50U484I8?

The EP2C50U484I8 positions itself as a mid-range Cyclone II FPGA that balances substantial logic and memory resources with a high I/O count in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for engineered systems requiring reliable operation across a wide temperature range.

This device is well suited for teams implementing low-cost embedded processors, DSP functions, or interfacing to external memories where the combination of logic density, on-chip RAM, and I/O flexibility simplifies system design and reduces component count. Comprehensive device documentation supports robust implementation and integration into production designs.

Request a quote or submit a quote for availability and pricing for the EP2C50U484I8 to move your design forward.

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