EP2C50U484I8
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 294 594432 50528 484-FBGA |
|---|---|
| Quantity | 97 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 294 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3158 | Number of Logic Elements/Cells | 50528 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 594432 |
Overview of EP2C50U484I8 – Cyclone® II Field Programmable Gate Array (FPGA) IC
The EP2C50U484I8 is a Cyclone® II FPGA device offering a mid-range FPGA fabric with substantial on-chip resources for embedded processing and signal processing applications. It combines a high count of logic elements and dedicated on-chip memory with a wide I/O complement in a compact 484-ball FBGA package targeted at industrial applications.
Typical use cases include low-cost embedded processing and DSP-centric designs where deterministic I/O and moderate logic and memory resources are required. The device supports industrial operating conditions and a narrow core supply range to meet system design requirements.
Key Features
- Logic Capacity — 50,528 logic elements provide a large programmable fabric for implementing complex control, datapath, and glue-logic functions.
- Logic Array Blocks — 3,158 logic array blocks (LABs) for structured logic organization and efficient mapping of designs across the device.
- Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (594,432 total bits) to support buffering, FIFOs, and small on-chip data stores without external memory.
- I/O Density — 294 I/O pins to accommodate parallel interfaces, external memory buses, and system control signals.
- Power Supply Range — Core voltage supply from 1.15 V to 1.25 V suitable for Cyclone II power domains.
- Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C to meet industrial temperature requirements.
- Package — 484-ball FBGA package; supplier device package listed as 484-UBGA (19×19) for compact board-level integration.
- RoHS Compliance — Device is RoHS compliant.
Typical Applications
- Low-Cost Embedded Processing — Implement control logic, soft processors, and custom peripherals using the device’s logic capacity and embedded memory.
- DSP and Signal Processing — Support low-cost DSP solutions leveraging the Cyclone II architecture for arithmetic and data-path implementations.
- External Memory Interface Designs — Use the device’s I/O complement and architecture for designs that interface with external memories and parallel buses.
Unique Advantages
- High Logic Integration: 50,528 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
- Substantial On-Chip RAM: Approximately 0.59 Mbits of embedded memory reduces reliance on external RAM for buffering and small data stores.
- Generous I/O Count: 294 I/O pins allow flexible system interfacing and support for wide parallel buses or multiple interfaces.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
- Compact, Assembly-Friendly Package: 484-FBGA / 484-UBGA (19×19) packaging delivers a space-efficient footprint for dense board designs.
- Vendor Documentation: Supported by Cyclone II device handbook documentation for architecture, configuration, and timing guidance.
Why Choose EP2C50U484I8?
The EP2C50U484I8 positions itself as a mid-range Cyclone II FPGA that balances substantial logic and memory resources with a high I/O count in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for engineered systems requiring reliable operation across a wide temperature range.
This device is well suited for teams implementing low-cost embedded processors, DSP functions, or interfacing to external memories where the combination of logic density, on-chip RAM, and I/O flexibility simplifies system design and reduces component count. Comprehensive device documentation supports robust implementation and integration into production designs.
Request a quote or submit a quote for availability and pricing for the EP2C50U484I8 to move your design forward.

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