EP2C5AF256I8N

The EP2C5AF256I8N is an Intel Cyclone® II FPGA featuring a compact 256-ball BGA package and a mid-range logic capacity suited for cost-sensitive embedded designs. Built around the Cyclone II architecture, this device delivers programmable logic, on-chip RAM, and flexible I/O in an industrial-temperature-rated package.

Targeted at low-cost embedded processing and DSP applications, the device combines 4,608 logic elements, approximately 0.12 Mbits of embedded memory, and 158 I/O pins with a 1.15 V–1.25 V core supply range for integration into industrial systems requiring rugged operating temperature and surface-mount packaging.

Key Features

• Logic Capacity  4,608 logic elements providing mid-range programmable logic resources for control, glue-logic, and moderate-complexity designs.
• Logic Array Blocks (LABs)  288 logic array blocks (LABs) for organized placement of logic resources and predictable design mapping.
• Embedded Memory  Approximately 0.12 Mbits (119,808 bits) of on-chip RAM to support buffering, small FIFOs, and embedded data storage.
• I/O  158 general-purpose I/O pins to support diverse peripheral interfacing and board-level connectivity.
• Power  Core supply range of 1.15 V to 1.25 V for the device core.
• Package & Mounting  256-ball BGA package (listed as 256-LBGA and supplier package 256-FBGA, 17×17) designed for surface-mount assembly.
• Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Low-Cost Embedded Processing  Implements custom control logic and microcontroller offload in compact industrial and consumer systems.
• Low-Cost DSP Solutions  Supports modest DSP and signal-processing functions where integrated logic and memory are required.
• Flexible I/O Control  Drives board-level interfacing and glue logic across multiple peripherals using 158 I/O pins.

Unique Advantages

• Balanced Logic and Memory  4,608 logic elements combined with approximately 0.12 Mbits of embedded RAM provide a balanced resource set for mid-range custom logic and buffer needs.
• Predictable Design Mapping  288 LABs (logic array blocks) enable structured placement of logic for easier timing closure and floorplanning.
• Industrial Temperature Range  Rated from −40 °C to 100 °C for applications that require broader thermal tolerance.
• High I/O Count  158 I/O pins allow flexible connectivity to sensors, memory interfaces, and peripheral devices without external I/O expanders.
• Compact Surface-Mount Package  256-ball BGA (256-LBGA / 256-FBGA 17×17) reduces board footprint while supporting high-density routing.
• Regulatory Friendly  RoHS compliance supports lead-free assembly workflows and regulatory requirements.

Why Choose EP2C5AF256I8N?

The EP2C5AF256I8N positions itself as a practical Cyclone II-based FPGA for engineers seeking a cost-effective, mid-capacity programmable device with industrial thermal tolerance. Its combination of 4,608 logic elements, organized LAB structure, on-chip RAM, and 158 I/O pins makes it well suited for embedded processing and modest DSP tasks where size, power, and BOM efficiency matter.

Manufactured in a 256-ball BGA surface-mount package and specified for −40 °C to 100 °C operation, this device delivers a compact, integrated platform for developers aiming to reduce external components while maintaining design flexibility and long-term manufacturability.

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