EP2C5F256C6

The EP2C5F256C6 is a Cyclone® II Field Programmable Gate Array (FPGA) IC from Intel, offered in a 256-LBGA package. It implements the Cyclone II architecture and provides a balanced mix of logic capacity, on-chip memory, and rich I/O suited to cost-sensitive embedded and DSP-focused designs.

Documented in the Cyclone II Device Handbook, this device targets low-cost embedded processing and DSP solutions where a defined number of logic elements, abundant I/O, and a standard commercial temperature range are required.

Key Features

• Core Logic  4,608 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 0.12 Mbits (119,808 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Capacity  158 user I/O pins to support multiple peripheral interfaces and parallel connections.
• Package & Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) with surface-mount mounting for PCB assembly.
• Power  Core supply range of 1.15 V to 1.25 V for integration with standard FPGA power rails.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C.
• Family Architecture Highlights  The Cyclone II family handbook documents architecture elements such as global clock networks, PLLs, embedded multipliers, I/O features, and programmable memory modes that apply to Cyclone II devices.
• Regulatory  RoHS compliant.

Typical Applications

• Low‑Cost Embedded Processing  Ideal for cost-sensitive embedded control and processing tasks that require programmable logic and on-chip memory.
• Low‑Cost DSP Solutions  Suitable for signal-processing blocks where a combination of logic elements and on-chip RAM is required, as referenced in the Cyclone II documentation.
• Interface Bridging & Glue Logic  158 I/Os enable the device to serve as an interface hub between multiple parallel and serial peripherals.

Unique Advantages

• Compact logic capacity: 4,608 logic elements deliver a predictable development target for mid-range FPGA designs.
• On‑chip memory for local data storage: ~0.12 Mbits of RAM reduces the need for external memory in many buffering and control tasks.
• High I/O count: 158 user I/Os support diverse peripheral and bus connectivity without immediate external glue logic.
• Standard commercial temperature grade: 0 °C to 85 °C simplifies selection for mainstream consumer and industrial-adjacent applications that do not require extended-temperature parts.
• Surface-mount 256-LBGA packaging: Compact board footprint with a supplier-specified 256-FBGA (17×17) outline for consistent assembly and layout planning.
• RoHS compliance: Conforms to common environmental requirements for lead-free manufacturing.

Why Choose EP2C5F256C6?

The EP2C5F256C6 positions itself as a Cyclone II family device that balances logic capacity, embedded memory, and abundant I/O in a compact 256-LBGA footprint. Its documented Cyclone II architecture features—summarized in the Cyclone II Device Handbook—support common embedded and DSP design building blocks such as clocking, memory modes, and multiplier resources.

This device is well suited to designers and procurement teams building low-cost embedded processing, interface bridging, or DSP-lean systems that require a defined logic density, substantial I/O, and standard commercial operating conditions. Its combination of measurable specifications and family-level architecture documentation supports predictable system integration and lifecycle planning.

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