EP2C5F256C7N

The EP2C5F256C7N is a Cyclone® II Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 256-ball BGA package. It implements the Cyclone II architecture to provide a balance of programmable logic, embedded memory, and flexible I/O for commercial embedded processing and DSP-oriented designs.

Key on-chip resources include 4,608 logic elements, approximately 0.12 Mbits of embedded memory, and 158 I/O pins. The device operates from a 1.15 V to 1.25 V core supply and is rated for commercial temperature operation (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Core Logic — 4,608 logic elements suitable for moderate-density programmable logic implementations and custom digital functions.
• Embedded Memory — Approximately 0.12 Mbits of on-chip RAM for frame buffers, FIFOs, and small data storage close to logic.
• I/O Capacity — 158 I/O pins support a wide range of external interfaces and peripheral connections.
• Cyclone II Architecture Features — Device handbook documents integrated capabilities such as a global clock network, PLLs, embedded multipliers and M4K memory blocks for DSP and timing-critical applications.
• Power — Low-voltage core operation with a specified supply range of 1.15 V to 1.25 V to match modern low-voltage system rails.
• Package & Mounting — 256-ball LBGA mounting (supplier device package listed as 256-FBGA 17×17) in a surface-mount form factor for compact board designs.
• Operating Range & Compliance — Commercial-grade temperature range of 0 °C to 85 °C and RoHS compliant for regulatory alignment.

Typical Applications

• Embedded Processing — Implement microcontroller-style logic, glue logic or custom state machines where moderate logic density and on-chip RAM simplify board-level design.
• DSP and Signal Processing — Use embedded multipliers and M4K memory blocks described in the Cyclone II handbook for low-cost DSP tasks and data path acceleration.
• High-Speed I/O and Memory Interfaces — 158 I/O pins and documented external memory interfacing capabilities enable controllers, interface bridges, and peripheral expansion.

Unique Advantages

• Balanced Logic and Memory: 4,608 logic elements combined with on-chip RAM provide a compact implementation platform for mixed-control and data processing tasks.
• Flexible I/O Count: 158 available I/Os make it easier to connect sensors, memories, and peripheral devices without excessive external glue logic.
• Low-Voltage Core: 1.15 V–1.25 V supply aligns with low-voltage system architectures to help reduce overall power budget.
• Compact Surface-Mount Package: 256-ball BGA packaging (17×17 supplier footprint) supports small form-factor PCB designs while maintaining thermal and signal integrity.
• Documented Architecture: The Cyclone II device handbook provides detailed guidance on clocking, PLLs, embedded multipliers, and routing to help accelerate design and verification.
• Regulatory Alignment: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP2C5F256C7N?

The EP2C5F256C7N positions itself as a commercially graded Cyclone II FPGA that combines a practical logic capacity, embedded memory, and generous I/O count in a compact BGA package. It is suited for designers seeking a documented, low-cost programmable device for embedded control, DSP acceleration, and interface bridging within the 0 °C to 85 °C commercial range.

With a defined core voltage range and clear architectural references in the Cyclone II handbook, this device supports straightforward integration into low-voltage system designs while maintaining design transparency through Intel/Altera documentation.

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